A Consummate Model of VLSI Education for Preparing the Workforce towards Meeting the Challenges of the Hi-Tech Industry through Industrial Involvement

In order to prepare the workforce for VLSI program, theoretical instructions must be complemented with adequate laboratory facilities in order to validate the design from its conception to the finished chip along with its real time testing.This comprises of four distinct and disparate phases namely-Phase 1: Chip design -This basically involves the design of the chip based on specifications provided by the customer, Phase 2: Mask Set -It involves the conversion of design's layout and placement into set of masks e.g.diffusion, contact, and metallization masks etc., Phase 3: Mask Transfer -This involves transferring the mask set onto a wafer substrate such as Si or GaAs etc., Phase 4: Packaged Chip -This incorporates inscribing, dicing, bonding and encapsulating chip in a plastic or ceramic package, depending on customer's requirement.Most of these phases require industrial involvement to a great extent.

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Published
2025-04-01
DOI
https://doi.org/10.18260/1-2-1153-53138
Primary Topic
Higher Education Learning Practices
Type
article
Field-Weighted Citation Impact
0.00

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article

A Consummate Model of VLSI Education for Preparing the Workforce towards Meeting the Challenges of the Hi-Tech Industry through Industrial Involvement

Kanti Prasad
Higher Education Learning Practices
article

A Consummate Model of VLSI Education for Preparing the Workforce towards Meeting the Challenges of the Hi-Tech Industry through Industrial Involvement

Kanti Prasad
article en

Abstract

In order to prepare the workforce for VLSI program, theoretical instructions must be complemented with adequate laboratory facilities in order to validate the design from its conception to the finished chip along with its real time testing.This comprises of four distinct and disparate phases namely-Phase 1: Chip design -This basically involves the design of the chip based on specifications provided by the customer, Phase 2: Mask Set -It involves the conversion of design's layout and placement into set of masks e.g.diffusion, contact, and metallization masks etc., Phase 3: Mask Transfer -This involves transferring the mask set onto a wafer substrate such as Si or GaAs etc., Phase 4: Packaged Chip -This incorporates inscribing, dicing, bonding and encapsulating chip in a plastic or ceramic package, depending on customer's requirement.Most of these phases require industrial involvement to a great extent.

University of Massachusetts Lowell (US)
Intel Corporation
Decent work and economic growth
Openalex Percentile: Top 94%
Higher Education Learning Practices
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A Consummate Model of VLSI Education for Preparing the Workforce towards Meeting the Challenges of the Hi-Tech Industry through Industrial Involvement — Kanti Prasad · (2025) | TGRS Research Map | TGRS