Improving p-Type Doping in Gallium Nitride through Magnesium Diffusion

Abstract Achieving high p -type doping levels selectively in gallium nitride (GaN) is a nontrivial task. In this work, we present a method for diffusing Mg from a finite source into the GaN layer, creating a highly doped layer with Mg without the need for additional epitaxial growth. Secondary ion mass spectroscopy analysis confirmed a diffusion depth of approximately 50 nm with a surface doping concentration of ~10 22 cm −3 . Confirmation of activation was determined via electrical characterization. This activation of the p -GaN substrate demonstrated a 40% improvement in contact resistance, achieving a specific contact resistance of 7.5 × 10 −4 Ω∙cm 2 . This method offers a promising alternative to ion implantation, which requires high temperature annealing for lattice recovery. In contrast, our approach requires lower thermal energy, overcoming one of the major challenges in doping GaN.

Authors

Institutions

Publication Details

Journal
Journal of Electronic Materials
Published
2025-03-30
DOI
https://doi.org/10.1007/s11664-025-11882-y
Primary Topic
GaN-based semiconductor devices and materials
Type
article
Field-Weighted Citation Impact
0.00

Funders

Controls
|||
ALL TIME
JAN
FEB
MAR
APR
MAY
JUN
JUL
AUG
SEP
OCT
article

Improving p-Type Doping in Gallium Nitride through Magnesium Diffusion

Mona A. Ebrish, Haley E. Dishman, Owen R. Meilander
Journal of Electronic Materials
GaN-based semiconductor devices and materials
article

Improving p-Type Doping in Gallium Nitride through Magnesium Diffusion

Mona A. Ebrish, Haley E. Dishman, Owen R. Meilander
article en

Abstract

Abstract Achieving high p -type doping levels selectively in gallium nitride (GaN) is a nontrivial task. In this work, we present a method for diffusing Mg from a finite source into the GaN layer, creating a highly doped layer with Mg without the need for additional epitaxial growth. Secondary ion mass spectroscopy analysis confirmed a diffusion depth of approximately 50 nm with a surface doping concentration of ~10 22 cm −3 . Confirmation of activation was determined via electrical characterization. This activation of the p -GaN substrate demonstrated a 40% improvement in contact resistance, achieving a specific contact resistance of 7.5 × 10 −4 Ω∙cm 2 . This method offers a promising alternative to ion implantation, which requires high temperature annealing for lattice recovery. In contrast, our approach requires lower thermal energy, overcoming one of the major challenges in doping GaN.

Journal of Electronic MaterialsVol. 54(6)
Vanderbilt University (US)
Defense Sciences Office, DARPA, Air Force Research Laboratory
Openalex Percentile: Top 96%
GaN-based semiconductor devices and materials
AI Navigator

Ask Laika to Summarize, Analyze, and Connect papers live on the map.

Summarize Papers & Methodologies

Extract key findings, datasets, and comparative methods across publications.

Benchmark Rankings & Visual Analytics

Rank top research institutions, authors, funders, topics, and journals by Field-Weighted Citation Impact (FWCI) and paper volume with instant charts.

Connect Distant Disciplines

Bridge topological clusters on the map to find hidden collaborative intersections.

Improving p-Type Doping in Gallium Nitride through Magnesium Diffusion — Mona A. Ebrish, Haley E. Dishman, et al. · Journal of Electronic Materials (2025) | TGRS Research Map | TGRS