Impact of PCM on Heat Dissipation from IC Chips

This study systematically investigates the thermal performance of nine Integrated Circuits (ICs) arranged in symmetric and asymmetric configurations on a substrate board. The analysis considers two scenarios: with and without the incorporation of Phase Change Material (PCM). The ICs were subjected to varying heat flux levels to assess their thermal behavior under different operating conditions. Results indicate that the temperature of the ICs is significantly influenced by factors such as IC size, positional arrangement, and the magnitude of the applied heat flux. The study also examines the role of the non-dimensional geometric distance parameter (λ), which varies with both IC size and location on the substrate. At a specific λ value of 0.19, notable temperature reductions were observed. Without PCM, temperature reductions of 18.79% and 26.48% were recorded at airflow velocities of 3 m/s and 5 m/s, respectively. The integration of PCM led to further enhancements, achieving reductions of 23.58% at 3 m/s and 32.47% at 5 m/s. These findings underscore the effectiveness of PCM in improving thermal management by efficiently absorbing and dissipating heat. Further statistical analysis revealed a strong correlation between the non-dimensional temperature parameter (θ) and λ, with a coefficient of determination (R²) of 0.97 and a Root Mean Square (RMS) error of 0.012%. Higher λ values consistently correlated with lower peak IC temperatures, suggesting that increasing the spatial separation between heat-generating components enhances heat dissipation and overall thermal performance. These findings have critical implications for thermal design engineering. By strategically optimizing IC placement on substrates, engineers can improve the reliability and lifespan of electronic systems. Additionally, the integration of PCM offers a practical solution for managing heat in compact electronic assemblies, providing a foundational framework for advanced cooling strategies in modern electronic devices. Major Findings: Temperature Dependence: The temperature of an IC is significantly influenced by its size, location on the board, and the amount of heat it generates. The non-dimensional geometric distance parameter (λ) also plays a crucial role in determining temperature distribution. Impact of PCM: The integration of PCM resulted in a substantial temperature reduction, ranging from 18.79% to 32.47%, compared to configurations without PCM, especially for higher λ values (0.19). Improved Chip Lifespan: By lowering IC temperatures through PCM-based cooling, the lifespan of the chips can be significantly extended, as they operate within optimal temperature ranges.