Laser printing and laser sintering as a digital approach for the fabrication of micro-conductive patterns on flexible substrates

The advanced requirements of flexible and large-area electronics demand low-temperature, solvent-free and mask-less processing of patterns with versatile form factors. Laser-induced forward transfer of metal nanoparticle inks, followed by laser sintering, is a key technology for flexible electronics. However, challenges remain for flexible, thermally sensitive substrates. We explore laser printing and processing of Ag nanoparticle inks on sensitive substrates and non-planar structures. Key parameters such as laser repetition rate and pulse overlap are investigated. Electrical behaviour and morphological characteristics of the fabricated structures are suitable for organic photovoltaics and thin film transistors.