Dual-Band Low-Profile Antenna Design Using HMSIW Based on Through-Glass Vias (TGVs)

This letter presents two dual-band (DB) low-profile antenna designs for Ka-band applications, integrating a hybrid structure of a DB-patch and a DB-half-mode substrate integrated waveguide resonator fabricated using through-glass vias (TGVs) technology. The proposed designs achieve DB operation with enhanced bandwidth and gain, all within a single-layer substrate to maintain a compact profile. Ant.1 employs a dual-cavity configuration, while Ant. 2 utilizes a single cavity supporting <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><tex-math notation="LaTeX">$\text{TE}_{101}$</tex-math></inline-formula> and <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><tex-math notation="LaTeX">$\text{TE}_{301}$</tex-math></inline-formula> mode. A prototype of Ant. 1 was fabricated and tested to validate the design. Measurements demonstrate a −10 dB impedance bandwidth of 25.58 GHz to 28.26 GHz (10%) for the lower band and 36.83 GHz to 38.94 GHz (5.5%) for the higher band, with peak gains of 6.1 dBi and 5.6 dBi, respectively. Compared to existing designs, Ant. 1 achieves a lower profile (0.04 <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"><tex-math notation="LaTeX">$\lambda _{0}$</tex-math></inline-formula>) in the Ka band while maintaining competitive performance. This work offers a promising solution for compact and efficient DB antennas in Ka-band communication systems.