Direct orientational epitaxy of wafer-scale 2D van der Waals heterostructures of metal dichalcogenides

Two-dimensional (2D) van der Waals (vdW) heterostructures have emerged as a groundbreaking candidate for future integrated circuits due to their tunable band structures, atomically sharp interfaces and seamless compatibility with complementary metal-oxide-semiconductor technologies. Despite their promise, existing synthesis methods, such as mechanical transfer and vapor-phase conversion, struggle to achieve the high-quality, scalable production for practical applications. In response to these longstanding challenges, our study unveils for the first time the direct epitaxial growth of wafer-scale 2D vdW heterostructures (MoS[Formula: see text]/SnS[Formula: see text]) with exceptional quality and uniformity. This achievement is made possible through fundamentally enhancing the adsorption interactions between intermediates and the underlying material. The heterostructures display pristine, defect-free interfaces, consistent crystal orientation and wafer-level thickness uniformity. The Raman peak shifts of MoS[Formula: see text] and SnS[Formula: see text] are constrained to below 0.5 cm[Formula: see text] across the entire wafer, with intensity deviations maintained within an impressive 2%, and thickness uniformity surpassing 99.5%. Owing to their exceptional crystallinity and interface quality, the heterostructures demonstrate extraordinary electron and hole transfer capabilities, showcasing a prominent rectification effect and an astounding responsivity of [Formula: see text] A/W, averaged from 30 devices. Our study signifies a pivotal advancement for the integration of 2D materials into semiconductor technologies, paving the way for next-generation integrated circuits.

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Publication Details

Journal
National Science Review
Published
2025-03-31
DOI
https://doi.org/10.1093/nsr/nwaf119
Citations
8
Primary Topic
2D Materials and Applications
Type
article
Field-Weighted Citation Impact
4.14
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article

Direct orientational epitaxy of wafer-scale 2D van der Waals heterostructures of metal dichalcogenides

Hao Luo, Tianyou Zhai, Jiashu Yang, Feng Ding et al.
8 citations
National Science Review
2D Materials and Applications
4.14
article

Direct orientational epitaxy of wafer-scale 2D van der Waals heterostructures of metal dichalcogenides

Hao Luo, Tianyou Zhai, Jiashu Yang, Feng Ding, Shenghong Liu, Tao Hu, Zhen Cui, Xinran Wang, Yuan Li, Taotao Li, Ke Qin, Jingsong Wu
article en
8 citations

Abstract

Two-dimensional (2D) van der Waals (vdW) heterostructures have emerged as a groundbreaking candidate for future integrated circuits due to their tunable band structures, atomically sharp interfaces and seamless compatibility with complementary metal-oxide-semiconductor technologies. Despite their promise, existing synthesis methods, such as mechanical transfer and vapor-phase conversion, struggle to achieve the high-quality, scalable production for practical applications. In response to these longstanding challenges, our study unveils for the first time the direct epitaxial growth of wafer-scale 2D vdW heterostructures (MoS[Formula: see text]/SnS[Formula: see text]) with exceptional quality and uniformity. This achievement is made possible through fundamentally enhancing the adsorption interactions between intermediates and the underlying material. The heterostructures display pristine, defect-free interfaces, consistent crystal orientation and wafer-level thickness uniformity. The Raman peak shifts of MoS[Formula: see text] and SnS[Formula: see text] are constrained to below 0.5 cm[Formula: see text] across the entire wafer, with intensity deviations maintained within an impressive 2%, and thickness uniformity surpassing 99.5%. Owing to their exceptional crystallinity and interface quality, the heterostructures demonstrate extraordinary electron and hole transfer capabilities, showcasing a prominent rectification effect and an astounding responsivity of [Formula: see text] A/W, averaged from 30 devices. Our study signifies a pivotal advancement for the integration of 2D materials into semiconductor technologies, paving the way for next-generation integrated circuits.

National Science ReviewVol. 12(5)
Wuhan University of Technology (CN), Nanjing University of Information Science and Technology (CN), Xi’an University (CN), Suzhou Research Institute (CN), Division of Materials Science and Engineering (AU), Xi'an University of Technology (CN), Materials Processing (United States) (US), Huazhong University of Science and Technology (CN), Nanjing University (CN)
Openalex Percentile: Top 6%
2D Materials and Applications
4.14
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