Thermal Atomic Layer Etching of Zinc Oxide from 30–300 °C Using Sequential Exposures of Hydrogen Fluoride and Trimethylgallium

Thermal atomic layer etching (ALE) of zinc oxide (ZnO) was demonstrated over a large temperature range from 30–300 °C using sequential exposures of HF (hydrogen fluoride) and Ga(CH3)3 (trimethylgallium (TMG)). In contrast to earlier studies of thermal ZnO ALE using sequential exposures of HF and trimethylaluminum (TMA), ZnO ALE with sequential HF and TMG exposures occurred without competing GaF3 atomic layer deposition (ALD) or ZnO conversion. Quartz crystal microbalance (QCM) studies during ZnO ALE revealed a stepwise mass increase during fluorination by HF exposures and a larger mass decrease during ligand-exchange by TMG exposures. The mass changes per cycle (MCPC) were self-limiting versus HF and TMG exposures at 100 °C. Spectroscopic ellipsometry measured etch rates over a wide temperature range. The etch rates varied from 0.24 Å/cycle at 30 °C to 3.82 Å/cycle at 300 °C. The temperature-dependent etch rates were consistent with an activation barrier of Ea = 3.3 kcal/mol. TMG exposures were also compared with TMA exposures at 100 °C on fresh ZnO surfaces grown by ZnO ALD. TMG exposures led to a mass gain consistent with TMG adsorption. In contrast, TMA exposures produced a mass loss consistent with the conversion of ZnO to Al2O3. Previous studies showed that conversion of ZnO to Al2O3 prevented ZnO ALE using HF and TMA exposures at temperatures less than 205 °C. Etching at <205 °C was restricted because HF adsorption on fluorinated Al2O3 led to competing AlF3 ALD. In contrast, ZnO ALE at temperatures as low as 30 °C is possible because no competing GaF3 ALD occurs using HF and TMG exposures. Quadrupole mass spectrometry (QMS) experiments were also performed to identify the etch products during ZnO ALE. The QMS experiments support fluorination and ligand-exchange reactions without conversion during ZnO ALE using HF and TMG exposures. The HF and TMG exposures were selective for ZnO ALE compared with HfO2, ZrO2 or Al2O3 ALE. ZnO ALE could also smooth ZnO surfaces progressively versus number of ZnO ALE cycles.

Authors

Institutions

Publication Details

Journal
Chemistry of Materials
Published
2025-03-31
DOI
https://doi.org/10.1021/acs.chemmater.5c00028
Citations
2
Primary Topic
Semiconductor materials and devices
Type
article
Field-Weighted Citation Impact
1.46

Funders

Controls
|||
ALL TIME
JAN
FEB
MAR
APR
MAY
JUN
JUL
AUG
SEP
OCT
article

Thermal Atomic Layer Etching of Zinc Oxide from 30–300 °C Using Sequential Exposures of Hydrogen Fluoride and Trimethylgallium

Jonathan L. Partridge, Steven M. George, David R. Zywotko, Taewook Nam et al.
2 citations
Chemistry of Materials
Semiconductor materials and devices
1.46
article

Thermal Atomic Layer Etching of Zinc Oxide from 30–300 °C Using Sequential Exposures of Hydrogen Fluoride and Trimethylgallium

Jonathan L. Partridge, Steven M. George, David R. Zywotko, Taewook Nam, Troy A. Colleran
article en
2 citations

Abstract

Thermal atomic layer etching (ALE) of zinc oxide (ZnO) was demonstrated over a large temperature range from 30–300 °C using sequential exposures of HF (hydrogen fluoride) and Ga(CH3)3 (trimethylgallium (TMG)). In contrast to earlier studies of thermal ZnO ALE using sequential exposures of HF and trimethylaluminum (TMA), ZnO ALE with sequential HF and TMG exposures occurred without competing GaF3 atomic layer deposition (ALD) or ZnO conversion. Quartz crystal microbalance (QCM) studies during ZnO ALE revealed a stepwise mass increase during fluorination by HF exposures and a larger mass decrease during ligand-exchange by TMG exposures. The mass changes per cycle (MCPC) were self-limiting versus HF and TMG exposures at 100 °C. Spectroscopic ellipsometry measured etch rates over a wide temperature range. The etch rates varied from 0.24 Å/cycle at 30 °C to 3.82 Å/cycle at 300 °C. The temperature-dependent etch rates were consistent with an activation barrier of Ea = 3.3 kcal/mol. TMG exposures were also compared with TMA exposures at 100 °C on fresh ZnO surfaces grown by ZnO ALD. TMG exposures led to a mass gain consistent with TMG adsorption. In contrast, TMA exposures produced a mass loss consistent with the conversion of ZnO to Al2O3. Previous studies showed that conversion of ZnO to Al2O3 prevented ZnO ALE using HF and TMA exposures at temperatures less than 205 °C. Etching at <205 °C was restricted because HF adsorption on fluorinated Al2O3 led to competing AlF3 ALD. In contrast, ZnO ALE at temperatures as low as 30 °C is possible because no competing GaF3 ALD occurs using HF and TMG exposures. Quadrupole mass spectrometry (QMS) experiments were also performed to identify the etch products during ZnO ALE. The QMS experiments support fluorination and ligand-exchange reactions without conversion during ZnO ALE using HF and TMG exposures. The HF and TMG exposures were selective for ZnO ALE compared with HfO2, ZrO2 or Al2O3 ALE. ZnO ALE could also smooth ZnO surfaces progressively versus number of ZnO ALE cycles.

Chemistry of MaterialsVol. 37(8)
University of Colorado System (US), Sejong University (KR), Institute of Semiconductor Physics (RU)
Semiconductor Research Corporation, Lam Research, Tokyo Electron, Sejong University
Openalex Percentile: Top 18%
Semiconductor materials and devices
1.46
AI Navigator

Ask Laika to Summarize, Analyze, and Connect papers live on the map.

Summarize Papers & Methodologies

Extract key findings, datasets, and comparative methods across publications.

Benchmark Rankings & Visual Analytics

Rank top research institutions, authors, funders, topics, and journals by Field-Weighted Citation Impact (FWCI) and paper volume with instant charts.

Connect Distant Disciplines

Bridge topological clusters on the map to find hidden collaborative intersections.