Study on the Embrittlement of Steel Grain Boundaries Caused by Penetration and Diffusion of Liquid Copper

This paper investigated and experimentally analyzed the penetration behavior of liquid copper along austenite grain boundaries (GBs) at high temperatures. The microstructure of the liquid copper channel network along GBs and triple junctions (TJs), as well as the TJ wetting, was observed and interpreted through diffusion-controlled premelted GB formation. The concentration distribution results along GBs show that copper diffusion in both the near-surface premelted GBs and the non-surface-layer solid-state GBs conform to the diffusion equation, though the diffusion coefficients differ by approximately one order of magnitude. However, the copper concentration at premelted GBs cannot be fully described by an error solution. Using a modified diffusion equation when considering the concentration dependence of the GB diffusion coefficient provides a more accurate description, aligning better with experimental characteristics. Electron backscatter diffraction measurements indicate that the copper orientation at premelted GBs remains consistent with that of surface copper coating, whereas that at solid-state GBs undergoes significant changes. This finding is consistent with the argument that the corresponding material states at premelted GBs are different from those at solid-state GBs, thus providing experimental evidence for the diffusion equation solutions presented above. It provides a theoretical reference for understanding and preventing liquid metal embrittlement.