Design and Process Implementation of Silicon-Based Carrier for 100 G/200 G Electro-Absorption Modulated Laser Chips

This paper presents a highly stable and integrated silicon-based carrier with broad application prospects. Traditional 800 G optical modules employ architectures based on aluminum nitride (AlN) carriers with externally mounted capacitors. However, such AlN-based architectures suffer from issues including high process complexity, elevated costs, poor environmental temperature adaptability, and difficulties in systematic crosstalk optimization. To address these challenges, this study conducted research on coplanar waveguide (CPW) transmission line structure design and optimization, high-density capacitor design and process implementation, and multi-channel crosstalk suppression. Based on these investigations, a silicon-based integrated carrier was designed and fabricated, incorporating resistors, capacitors, high-speed signal lines, and preformed AuSn structures. Test results demonstrate that the CPW transmission line structures fabricated on the silicon carrier exhibit excellent radio frequency performance with transmission losses below 1 dB within 67 GHz. The developed high-density capacitor structure achieves a remarkable capacitance density of 26.83 nF/mm² and withstands voltages exceeding 24 V at 1 μA current, reaching state-of-the-art levels. This paper also proposes crosstalk reduction solutions including increased channel spacing, the addition of wave-absorbing materials, and the implementation of metal barriers. Experimental results confirm that the developed integrated carrier demonstrates outstanding performance and reliability in high-frequency communications and optoelectronic devices.