Low-temperature, ultra-giant blistering of atomic layer deposited barrier coatings on polyethylene films caused by additive segregation

Low-temperature plasma enhanced atomic layer deposition (PE-ALD) is an advanced method for coating flexible polyolefin polymers such as low-density polyethylene (LDPE) to improve their barrier properties against moisture and gases. The ALD process is highly sensitive to surface preparation, and LDPE is challenging to coat due to its highly non-polar nature. In this work, we reveal how the segregation of polymer additives to the surface (commonly known as blooming) can compromise the effectiveness of the barrier coatings. After coating a 10 μm thick LDPE film with a 50 nm thick Al 2 O 3 layer using low-temperature PE-ALD, we observed the formation of ultra-giant blisters (larger than previously reported) within minutes of removing the sample from the processing chamber. Our conclusion is that the segregated antioxidant component, tris(2,4-di-tert-butylphenyl)phosphite, traps some of the trimethylaluminium (TMA) used as an ALD precursor. After deposition, the trapped TMA reacts with the moisture in the environment and the gaseous reaction product leads to the formation of ultra-giant blisters with bubble diameters ranging from hundreds of microns to over a millimeter. The bursting of these bubbles creates discontinuities and an increased number of cracks in the 50 nm thick alumina coating, hugely deteriorating its barrier properties. This is a previously unknown failure mode of ALD layers deposited on polymer films as interactions with additives are rarely investigated. We also demonstrate how the appropriate pre-treatments can effectively mitigate this problem, improving the coating's reliability. • Low-temperature blistering of a 50 nm PE-ALD Al2O3 coating on 10 μm LDPE was observed • Blisters are even larger than previously reported giant blisters of an ALD layer • Blistering is caused by segregated antioxidant additive trapping TMA precursor • External humidity diffusing through the polymer reacts with TMA producing methane • Plasma pre-treatment breaks down segregated antioxidant and prevents blistering

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Publication Details

Journal
Progress in Organic Coatings
Published
2025-03-30
DOI
https://doi.org/10.1016/j.porgcoat.2025.109261
Citations
2
Primary Topic
Semiconductor materials and devices
Type
article
Field-Weighted Citation Impact
1.46
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article

Low-temperature, ultra-giant blistering of atomic layer deposited barrier coatings on polyethylene films caused by additive segregation

Sándor Kéki, Zoltán Erdélyi, E. Baradács, Gergő Vecsei et al.
2 citations
Progress in Organic Coatings
Semiconductor materials and devices
1.46
article

Low-temperature, ultra-giant blistering of atomic layer deposited barrier coatings on polyethylene films caused by additive segregation

Sándor Kéki, Zoltán Erdélyi, E. Baradács, Gergő Vecsei, Bence Parditka, János J. Tomán, Lajos Nagy
article en
2 citations

Abstract

Low-temperature plasma enhanced atomic layer deposition (PE-ALD) is an advanced method for coating flexible polyolefin polymers such as low-density polyethylene (LDPE) to improve their barrier properties against moisture and gases. The ALD process is highly sensitive to surface preparation, and LDPE is challenging to coat due to its highly non-polar nature. In this work, we reveal how the segregation of polymer additives to the surface (commonly known as blooming) can compromise the effectiveness of the barrier coatings. After coating a 10 μm thick LDPE film with a 50 nm thick Al 2 O 3 layer using low-temperature PE-ALD, we observed the formation of ultra-giant blisters (larger than previously reported) within minutes of removing the sample from the processing chamber. Our conclusion is that the segregated antioxidant component, tris(2,4-di-tert-butylphenyl)phosphite, traps some of the trimethylaluminium (TMA) used as an ALD precursor. After deposition, the trapped TMA reacts with the moisture in the environment and the gaseous reaction product leads to the formation of ultra-giant blisters with bubble diameters ranging from hundreds of microns to over a millimeter. The bursting of these bubbles creates discontinuities and an increased number of cracks in the 50 nm thick alumina coating, hugely deteriorating its barrier properties. This is a previously unknown failure mode of ALD layers deposited on polymer films as interactions with additives are rarely investigated. We also demonstrate how the appropriate pre-treatments can effectively mitigate this problem, improving the coating's reliability. • Low-temperature blistering of a 50 nm PE-ALD Al2O3 coating on 10 μm LDPE was observed • Blisters are even larger than previously reported giant blisters of an ALD layer • Blistering is caused by segregated antioxidant additive trapping TMA precursor • External humidity diffusing through the polymer reacts with TMA producing methane • Plasma pre-treatment breaks down segregated antioxidant and prevents blistering

Progress in Organic CoatingsVol. 204
University of Debrecen (HU)
Openalex Percentile: Top 19%
Semiconductor materials and devices
1.46
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