Development and Characterization of Functional Acrylic Adhesives for the Transfer Process in Semiconductor Microchip Processes

ABSTRACT As the global semiconductor market steadily grows, optimizing manufacturing processes is becoming increasingly essential. For instance, when transferring semiconductor chips onto a substrate, each chip must securely adhere to a pressure‐sensitive film via a plunger and subsequently be individually separated post‐transfer. However, the strong adhesive force required to fix the chips in place may prevent them from easily detaching from the tape, potentially causing chip damage if excessive force is applied. This study develops a functional pressure‐sensitive adhesive (PSA) film that firmly holds semiconductor chips in place on the film; however, post‐transfer, this film enables their easy detachment and ultra‐low peel strength via ultraviolet (UV) curing and low‐temperature processing. The developed series of functional PSA films provides an initial adhesion strength in the range of 198–563 gf, ensuring secure chip fixation while achieving ultra‐low peel strength of up to 0.46 gf or lower and allowing for easy and damage‐free chip removal after transfer. This study on UV‐curable PSA films proposes a method for optimizing the semiconductor manufacturing process and can be highly beneficial for semiconductor packaging processes.