A Study on the Shortening of Flux Tool Cleaning Time with TRIZ

Recently, as the technology of memory semiconductors has changed rapidly and customer requirements are diversifying, numerous inflection points in the field have occurred, resulting in the first high-level problem.During the post-semiconductor process, the Solder Ball Mount process also requested a substrate with an OSP film that can increase the adhesion of the Soldier Ball according to the customer's request, and a new process called OPC for removing the OSP film had to be added to apply this.This increased the working time and caused additional problems.Since increasing the time in the semiconductor process increases the cost due to reduced productivity, the OPC process Skip could be carried out by applying improved Flux to solve this problem, but an additional problem that increased the maintenance time of the Flux Tool occurred.Triz's problem-solving process and tool were applied to solve this problem.The improvement was solved by changing the shape of the Flux Pin, and the Flux Tool Cleaning Time was reduced by 85%.In the problem-solving process, the root cause was found through functional interaction analysis, Root Cause analysis, Operating Zone, and Operating Time analysis, and the direction of improvement was selected through resource analysis and ideal solution, and technical contradiction, physical contradiction, standard solution, and FOS were used as problemsolving ideas.It can be useful to corporate practitioners as it can achieve maximum effect at a low cost by applying TRIZ to the first high-level problem that occurs.