HIGH-SOLID-LOADING, LOW-VISCOSITY PHOTOSENSITIVE Al ₂ O ₃ /SiO ₂ CERAMIC SLURRY FOR STEREOLITHOGRAPHY-BASED ADDITIVE MANUFACTURING

This study successfully produced Al 2 O 3 /SiO 2 photosensitive ceramic slurries, which have high solid loading and low viscosity, rendering them highly suitable for application in the field of additive manufacturing technology, specifically mask projection stereolithography (MP-SL). The performance of the slurries is mainly determined by their rheological properties and light curing parameters. Comprehensive evaluations were conducted on the viscosity, rheology, and stability of slurries with different solid content levels. Additionally, printed parts were manufactured using the same light curing process and subjected to rigorous mechanical properties and microstructure analysis tests. The results of the study showed that within the range of solid content from 46[Formula: see text]wt.% to 56[Formula: see text]wt.%, the viscosity of the slurry increased significantly. The research further revealed that to achieve successful light curing, the viscosity of the slurry should not exceed 2[Formula: see text]Pa[Formula: see text] at a shear rate of 50[Formula: see text]s[Formula: see text].