The Effect of Solution Treatment Temperature on The Interface Microstructure and Morphology of SiCp/Al-4.2Cu-4.0Mg Composite

To explore the impact of solution treatment temperature on the interface microstructure and morphology of SiCp/Al-4.2Cu-4.0Mg composite, this study subjected the SiCp/Al-4.2Cu-4.0Mg composite to heat treatment at 505°C, 510°C, 515°C, 520°C, and 525°C for 2 hours, respectively. The results indicated that the precipitated phase in the sintered composite matrix is Al2Cu. With increasing solution treatment temperature, the Al2Cu content gradually decreases, and it is nearly eliminated at 515°C. At this temperature, the compressive strength of the composite reaches 834 MPa, representing a 40% increase compared to the compressive strength of the sintered composite. On the other hand, the interfacial reaction in the composite continues, leading to an increase in the thickness of the interfacial layer from 300 nm to over 450 nm. The Al2Cu phase diffuses into the interfacial layer through solid-state diffusion, undergoing a phase transformation to form Al2CuMg.