Effect of Ultrasonic Vibration and Average Grain Size on the Deformability of T2 Copper in T-Shaped Micro-Upsetting

Ultrasonic vibration (UV)-assisted forming technology has emerged as a significant advancement in the field of bulk micro-forming. This study presents a comprehensive experimental investigation into the micro-scale deformation behavior of metallic materials and its influence on size effects under UV, with a specific focus on the UV-assisted T-shaped micro-upsetting of T2 copper. Utilizing a custom-designed UV-assisted micro-upsetting apparatus, the flow stress, filling height, and microstructural evolution of T2 copper are systematically examined, considering various grain sizes, die opening angles, and ultrasonic amplitudes. The findings demonstrate that UV significantly mitigates the influence of grain size effects. Notably, the softening effect induced by UV becomes more pronounced with decreasing grain size, concomitantly leading to increased filling height. As the die opening angle expands, the required forming load increases. The enhancement of ultrasonic amplitude not only increases the V-groove filling height but also improves the surface quality. The optimal V-groove filling performance is achieved at an ultrasonic amplitude of 8.01 μm. It is crucial to note that increased ultrasonic amplitude generally improves forming performance, while excessive ultrasonic amplitude may lead to micro-crack formation within the material, thereby decreasing the formability of T2 copper. These results provide valuable insights into the complex interplay between ultrasonic parameters and material response in micro-forming processes, offering significant implications for the optimization of UV-assisted forming technologies in precision manufacturing applications.