Warp monitoring and deformation control of composite laminate curing based on buckypaper sensors

Abstract Aiming to improve the deformation monitoring technology and deformation control methods during the curing of composite components, with the goal of online monitoring the deformation during curing and controlling its degree to achieve precise manufacturing. In terms of monitoring composite curing deformation, this paper utilizes the strain‐monitoring mechanism of buckypaper sensors and designs a monitoring scheme using a buckypaper sensor array to monitor the curing warpage deformation. To verify its accuracy, curvature calculations and ABAQUS simulations are conducted on the cured‐deformed composite components and characterized with the monitoring data from the sensor array. The experimental results validate the feasibility. Different from traditional deformation compensation processes, in controlling composite curing deformation, this paper adopts a post‐curing process to change the thermal expansion coefficient of the composite material, thereby controlling the curing deformation. Through the buckypaper sensor array for online monitoring of composite curing warpage deformation, the deformation during curing can be directly observed, and then the deformed composite components can be post‐cured in time to control the deformation and achieve the precise manufacturing of composite components. Highlights Buckypaper sensors can be embedded in composite layers and co‐cured. Buckypaper sensor array can online monitor the curing deformation of the composite. The warpage curvature of composites was compared between sensor monitoring and simulation. The warpage deformation of composite components can be controlled effectively by post‐curing.

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Publication Details

Journal
Polymer Composites
Published
2025-03-24
DOI
https://doi.org/10.1002/pc.29815
Citations
1
Primary Topic
Epoxy Resin Curing Processes
Type
article
Field-Weighted Citation Impact
0.71

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article

Warp monitoring and deformation control of composite laminate curing based on buckypaper sensors

Lu Zhang, Shaowei Lu, Qianqian Chu, Xiaoqiang Wang et al.
1 citations
Polymer Composites
Epoxy Resin Curing Processes
0.71
article

Warp monitoring and deformation control of composite laminate curing based on buckypaper sensors

Lu Zhang, Shaowei Lu, Qianqian Chu, Xiaoqiang Wang, Chengkun Ma, Shuang Qiao, Fangfei Liu, Yunqi Xie
article en
1 citations

Abstract

Abstract Aiming to improve the deformation monitoring technology and deformation control methods during the curing of composite components, with the goal of online monitoring the deformation during curing and controlling its degree to achieve precise manufacturing. In terms of monitoring composite curing deformation, this paper utilizes the strain‐monitoring mechanism of buckypaper sensors and designs a monitoring scheme using a buckypaper sensor array to monitor the curing warpage deformation. To verify its accuracy, curvature calculations and ABAQUS simulations are conducted on the cured‐deformed composite components and characterized with the monitoring data from the sensor array. The experimental results validate the feasibility. Different from traditional deformation compensation processes, in controlling composite curing deformation, this paper adopts a post‐curing process to change the thermal expansion coefficient of the composite material, thereby controlling the curing deformation. Through the buckypaper sensor array for online monitoring of composite curing warpage deformation, the deformation during curing can be directly observed, and then the deformed composite components can be post‐cured in time to control the deformation and achieve the precise manufacturing of composite components. Highlights Buckypaper sensors can be embedded in composite layers and co‐cured. Buckypaper sensor array can online monitor the curing deformation of the composite. The warpage curvature of composites was compared between sensor monitoring and simulation. The warpage deformation of composite components can be controlled effectively by post‐curing.

Polymer CompositesVol. 46(S1)
Shenyang Aerospace University (CN)
Chinese Aeronautical Establishment, Chunhui Project Foundation of the Education Department of China
Openalex Percentile: Top 35%
Epoxy Resin Curing Processes
0.71
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