Vertically Integrated Substrate Integrated Cavity Based Filtering Antenna

This paper introduces an innovative design of a compact filtenna utilizing Substrate Integrated Waveguide (SIW) technology. The proposed design features a vertically integrated three-layer Substrate Integrated Cavity (SIC) to accomplish the proposed design using HFSS. The proposed filtenna achieves an impedance bandwidth of 190 MHZ (9.75 GHz - 9.94 GHz) with a flat gain of 5dBi. This three-layer architecture marks a significant advancement in the application of SIW technology within filtennas, paving the way for future developments in compact microwave components.