Tribological behavior of high‐performance polymers used in wafer production systems for enhanced efficiency

Abstract This study investigates the tribological performance of 6061‐T6 aluminum alloy and high‐performance polymers (polyoxymethylene copolymer (POM‐C), polytetrafluoroethylene (PTFE), polyamide‐6 (PA‐6), and cast polyamide‐6 (PA‐6G)) under dry sliding conditions, with a focus on their suitability for wafer machinery components. Tribological tests, conducted using a UTS 10/20 top‐disk tribometer, evaluated the materials' coefficients of friction (COF) and wear resistance. PA‐6G exhibited the lowest COF (0.16) and wear rate, demonstrating exceptional frictional and wear properties. This exceptional performance can be attributed to the polymer's unique molecular structure, which promotes a low‐friction interface and enhances its wear resistance. PA‐6 also showed strong performance, balancing durability, and moderate frictional resistance. PTFE displayed low friction (COF = 0.28), suitable for continuous motion systems, though its moderate wear resistance limits applications under severe conditions. POM‐C offered a balanced performance but showed a higher COF (0.34). Conversely, 6061‐T6 alloy exhibited significant abrasive wear and the highest wear rate (1.13 × 10 −3 mm 3 /Nm), highlighting the need for surface enhancements in high‐wear environments. These findings provide critical insights into material selection for wafer machinery components, emphasizing PA‐6G's potential to enhance operational efficiency and equipment longevity through superior tribological performance. Highlights PA‐6G offers the lowest COF (0.16) and superior wear resistance among tested materials. 6061‐T6 exhibits significant wear, necessitating surface treatments for improved durability. PTFE ensures low friction (COF = 0.28) but shows moderate wear resistance under sliding. PA‐6 balances low COF (0.22) and high wear resistance, ideal for durable applications. The findings suggest that optimized material selection could enhance the operational efficiency and reliability of wafer machinery components.