Design of U Band SIW Filter Based on TGV Technology

With the rapid development of wireless communication technology, microwave filters are facing increasing performance challenges Substrate-integrated waveguide (SIW) has attracted much attention in the field of microwave filter design due to its advantages of low insertion loss, high Q and excellent integration. However, the design and fabrication of conventional SIW filters are often constrained by conditions such as material selection and processing technology. In this paper, based on the glass through-hole (TGV) technology, we constructed a 3D encapsulated electromagnetic simulation model of the TGV using 3D electromagnetic field simulation software, deeply analyzed the characteristics of the TGV under high-frequency signals, and obtained the simulation results of the S-parameters, which demonstrated excellent high-frequency performance. On this basis, we designed a glass dielectric integrated SIW bandpass filter operating in the frequency band from 39.50 GHz to 41.5 GHz with a size of only 6 mm × 2 mm × 0.3 mm. The filter achieves S21 greater than -3 dB and S11 less than -12 dB within the band with excellent performance.