Enhancing Epoxy Toughness with a Bis-Hydroxy Urethane Diol Additive Derived from CO<sub>2</sub>-Based Ethylene Carbonate and Bio-Based Diamine

This study introduces a method to improve epoxy toughness by incorporating bis-hydroxy urethane diols derived from CO2-based ethylene carbonate and bio-based diamine as additives. This approach significantly enhances strength and elongation with minimal impact on adhesion. The key to this improvement lies in the integration of the diol molecules into the epoxy network during curing. The simplicity and eco-friendliness of this diol highlight its potential for practical applications, advancing the development of durable and sustainable materials.

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Publication Details

Journal
ACS Applied Engineering Materials
Published
2025-03-25
DOI
https://doi.org/10.1021/acsaenm.5c00196
Citations
3
Primary Topic
Photopolymerization techniques and applications
Type
article
Field-Weighted Citation Impact
2.81
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article

Enhancing Epoxy Toughness with a Bis-Hydroxy Urethane Diol Additive Derived from CO2-Based Ethylene Carbonate and Bio-Based Diamine

Ki Tae Nam, Min Sang Kwon, G.T. Kim, Jun‐Ho Jang et al.
3 citations
ACS Applied Engineering Materials
Photopolymerization techniques and applications
2.81
article

Enhancing Epoxy Toughness with a Bis-Hydroxy Urethane Diol Additive Derived from CO2-Based Ethylene Carbonate and Bio-Based Diamine

Ki Tae Nam, Min Sang Kwon, G.T. Kim, Jun‐Ho Jang, Jongwon Hwang, In Wook Song
article en
3 citations

Abstract

This study introduces a method to improve epoxy toughness by incorporating bis-hydroxy urethane diols derived from CO2-based ethylene carbonate and bio-based diamine as additives. This approach significantly enhances strength and elongation with minimal impact on adhesion. The key to this improvement lies in the integration of the diol molecules into the epoxy network during curing. The simplicity and eco-friendliness of this diol highlight its potential for practical applications, advancing the development of durable and sustainable materials.

ACS Applied Engineering MaterialsVol. 3(4)
Seoul National University (KR)
Openalex Percentile: Top 11%
Photopolymerization techniques and applications
2.81
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