Integrated Heat Dissipation of A Novel Laser Diode Array Substrate and A Liquid-cooled Microstructure

Abstract The integration of chip substrates with microchannels represents a cutting-edge research focus globally.Compared to traditional liquid-cooled microchannel heat sinks this technology offers revolutionary advantages and has been successfully applied in chips like insulated gate bipolar transistor demonstrating exceptional cooling perfor mance.As the demand for higher output power from semiconductor laser chips in large scientific facilities and indus trial applications increases heat management has become a critical issue.Traditional research on laser bar cooling has mainly focused on optimizing liquid-cooled heat sink structures.However their cooling capacity is constrained by thermal resistance of the heat transfer path.To address this challenge this study proposes a novel distributed flow pattern structure based on the integration of chip substrates with microchannels aiming for efficient cooling of semi