High-Performance Two-Tier FinFETs With Low-Temperature (≤ 500 °C) Silicide Dopant Segregation Schottky S-D for M3D Circuits

In this work, 2-tier Monolithic 3-Dimentional (M3D) integrated FinFETs and circuits are fabricated based on a low-temperature (<inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$\le 500~^{\circ }$ </tex-math></inline-formula>C) silicide dopant segregation Schottky Source/Drian (SDSS S-D) technology. By forming NiPt silicide followed by B/P implantation and optimizing annealing on top-tier fins, a sharpened Schottky Barrier of the silicide and a high dopant segregation concentration of the impurities are obtained in the improved silicide S-D with maximum process temperature below <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$500~^{\circ }$ </tex-math></inline-formula>C. As a result, Low-T 2-tier M3D FinFETs are obtained with I<inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">${}_{\text {ON}}= 646.4~\mu $ </tex-math></inline-formula>A/<inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$\mu $ </tex-math></inline-formula>m for PMOS and I<inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">${}_{\text {ON}} = 450.6~\mu $ </tex-math></inline-formula>A/<inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$\mu $ </tex-math></inline-formula>m for NMOS at L<inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">${}_{\text {G}}=500$ </tex-math></inline-formula> nm and a record I<inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">${}_{\text {ON}}=1.84$ </tex-math></inline-formula> mA/<inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$\mu $ </tex-math></inline-formula>m is achieved for PMOS at L<inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">${}_{\text {G}} =25$ </tex-math></inline-formula> nm under normalized footprint. Furthermore, M3D inverter, ring oscillators, as well as 6T SRAM with this technique are demonstrated, which is promising to provide an effective and low-cost method to achieve low-temperature high- performance silicon circuits in M3D applications.

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Publication Details

Journal
IEEE Electron Device Letters
Published
2025-03-24
DOI
https://doi.org/10.1109/led.2025.3553873
Citations
2
Primary Topic
Semiconductor materials and interfaces
Type
article
Field-Weighted Citation Impact
2.49

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article

High-Performance Two-Tier FinFETs With Low-Temperature (≤ 500 °C) Silicide Dopant Segregation Schottky S-D for M3D Circuits

Shujuan Mao, Mingzheng Ding, Feixiong Wang, Huaxiang Yin et al.
2 citations
IEEE Electron Device Letters
Semiconductor materials and interfaces
2.49
article

High-Performance Two-Tier FinFETs With Low-Temperature (≤ 500 °C) Silicide Dopant Segregation Schottky S-D for M3D Circuits

Shujuan Mao, Mingzheng Ding, Feixiong Wang, Huaxiang Yin, Qingzhu Zhang, Jiaxin Yao, Yadong Zhang, Jinbiao Liu, Xuexiang Zhang, Yunjiao Bao, Shuang Liu
article en
2 citations

Abstract

In this work, 2-tier Monolithic 3-Dimentional (M3D) integrated FinFETs and circuits are fabricated based on a low-temperature (<inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$\le 500~^{\circ }$ </tex-math></inline-formula>C) silicide dopant segregation Schottky Source/Drian (SDSS S-D) technology. By forming NiPt silicide followed by B/P implantation and optimizing annealing on top-tier fins, a sharpened Schottky Barrier of the silicide and a high dopant segregation concentration of the impurities are obtained in the improved silicide S-D with maximum process temperature below <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$500~^{\circ }$ </tex-math></inline-formula>C. As a result, Low-T 2-tier M3D FinFETs are obtained with I<inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">${}_{\text {ON}}= 646.4~\mu $ </tex-math></inline-formula>A/<inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$\mu $ </tex-math></inline-formula>m for PMOS and I<inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">${}_{\text {ON}} = 450.6~\mu $ </tex-math></inline-formula>A/<inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$\mu $ </tex-math></inline-formula>m for NMOS at L<inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">${}_{\text {G}}=500$ </tex-math></inline-formula> nm and a record I<inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">${}_{\text {ON}}=1.84$ </tex-math></inline-formula> mA/<inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$\mu $ </tex-math></inline-formula>m is achieved for PMOS at L<inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">${}_{\text {G}} =25$ </tex-math></inline-formula> nm under normalized footprint. Furthermore, M3D inverter, ring oscillators, as well as 6T SRAM with this technique are demonstrated, which is promising to provide an effective and low-cost method to achieve low-temperature high- performance silicon circuits in M3D applications.

IEEE Electron Device LettersVol. 46(5)
Chinese Academy of Sciences (CN), Institute of Microelectronics (CN)
Ministry of Science and Technology of the People's Republic of China, Beijing Municipal Natural Science Foundation
Affordable and clean energy
Openalex Percentile: Top 13%
Semiconductor materials and interfaces
2.49
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