Woven SiO _2f /SiO ₂ composites quasistatic scratch behavior and damage mechanism considering interface characteristics

Abstract Quasistatic scratch behavior and damage mechanism are basic issues for material removal and damage mechanism for woven SiO 2f /SiO 2 ceramic matrix composites (CMCs). The single abrasive grain scratching CMC finite element modeling (FEM) is constructed and verified under variable scratch depth by comparing FEM and experimental results. The stress fields for CMC, its matrix, fibers, and interface are analyzed, the stress fields for CMC and its SiO 2 matrix continue to expand and are basically consistent as scratch depth increases, and matrix strength field is the main impedance stress field during CMC removal process. Not only is the interface subjected to greater scratching force with increasing scratch depth, but also they extends to other adjacent coupled interfaces and get much greater, microcracks in the matrix diffuse and redirect on the surfaces of fibers and other fibers coupled under the action of scratching force, which results in interface damage and fibers debonding. SiO 2 matrix is removed for matrix stress above shear fracture strength, SiO 2 fibers are cut off for fibers stress above shear fracture strength. Damage morphology and modes are obviously different in areas between weft‐containing and warp‐containing CMC during scratching process.