A ring-oscillator-based 5.2-ps bin-size integrated circuit for time measurements

Abstract High-resolution time measurement is essential in time-of-flight positron-emission tomography and in high-energy physics experiments. The increasing demands for imaging accuracy and detector performance necessitate high-resolution and high-precision timing circuits. Based on a ring-oscillator delay line incorporating a phase-locked loop, a delay-locked loop, and a passive interpolation technique, we have developed a circuit that achieves an average bin size down to 5.2 ps in a 55-nm CMOS process. High resolution poses challenges in bin-size uniformity, multi-channel integration, power consumption, readout bandwidth, and potential bubble codes. In this prototype we primarily focus on achieving high resolution and establishing a test system. Design and simulation results will be presented, with preparations for testing on-going. In the subsequent iterations we will balance other issues and gradually research a production-ready design.

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Publication Details

Journal
Journal of Instrumentation
Published
2025-03-01
DOI
https://doi.org/10.1088/1748-0221/20/03/c03034
Primary Topic
Advancements in PLL and VCO Technologies
Type
article
Field-Weighted Citation Impact
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article

A ring-oscillator-based 5.2-ps bin-size integrated circuit for time measurements

L. Zhang, J. Ye, Bowen Deng, W. Zhang et al.
Journal of Instrumentation
Advancements in PLL and VCO Technologies
article

A ring-oscillator-based 5.2-ps bin-size integrated circuit for time measurements

L. Zhang, J. Ye, Bowen Deng, W. Zhang, Xiongbo Yan, C. Wang, D. Guo, Lulu Xiao, Xiaoting Li
article en

Abstract

Abstract High-resolution time measurement is essential in time-of-flight positron-emission tomography and in high-energy physics experiments. The increasing demands for imaging accuracy and detector performance necessitate high-resolution and high-precision timing circuits. Based on a ring-oscillator delay line incorporating a phase-locked loop, a delay-locked loop, and a passive interpolation technique, we have developed a circuit that achieves an average bin size down to 5.2 ps in a 55-nm CMOS process. High resolution poses challenges in bin-size uniformity, multi-channel integration, power consumption, readout bandwidth, and potential bubble codes. In this prototype we primarily focus on achieving high resolution and establishing a test system. Design and simulation results will be presented, with preparations for testing on-going. In the subsequent iterations we will balance other issues and gradually research a production-ready design.

Journal of InstrumentationVol. 20(03)
Hankou University (CN), Central China Normal University (CN), Wuhan Textile University (CN), Hubei Polytechnic University (CN), Institute of High Energy Physics (AT), Institute of High Energy Physics (CN), University of Chinese Academy of Sciences (CN)
Openalex Percentile: Top 96%
Advancements in PLL and VCO Technologies
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