Non-Invasive Wide-Field Imaging of Chip Surface Temperature Distribution Based on Ensemble Diamond Nitrogen-Vacancy Centers

With the development of chip technology, the demand for device reliability in various electronic chip industries continues to grow. In recent years, with the advancement of quantum sensors, the solid-state spin (nitrogen-vacancy) NV center temperature measurement system has garnered attention due to its high sensitivity and spatial range. However, NV centers are not only affected by temperature but also by magnetic fields. This article analyzes the impact of magnetic fields on temperature detection. By combining the wide-field imaging platform of optically detected magnetic resonance (ODMR) with a temperature-sensitive structure of thin ensemble diamond overlaid on a quartz substrate, high-sensitivity temperature detection has been achieved. And obtains a sensitivity of approximately 10 mK/Hz^1/2. By combining a CCD camera imaging system, it realizes a wide field of view of 500 μm², a high spatial resolution of 1.3 μm. Ultimately, this study demonstrates the two-dimensional actual temperature distribution on the chip surface under different currents, achieving wide-field, non-contact, high-speed temperature imaging of the chip surface.