Multifunctional Recyclable Electronic Skins Enabled by Hierarchical Dynamic Network Structures

Abstract Inspired by the sensory functions of the human skin, the development of electronic skins (e‐skins) has garnered significant attention. Ionogels, as an emerging class of soft materials, show promise in serving as e‐skins. The pursuit of a sustainable society motivates the development of recyclable ionogels, typically achieved by introducing dynamic non‐covalent bonds. However, these current state‐of‐the‐art methods often result in poor elasticity or strain softening, which significantly limits their suitability for e‐skin applications. This study introduces a multifunctional and recyclable e‐skin based on a hierarchical dynamic double‐network ionogel that integrates dynamic covalent bonds and non‐covalent interactions. This ionogel seamlessly integrates key functions of human skin, including strain‐stiffening capability, self‐healing ability within 12 h, rapid response time (120 ms), and high elasticity (energy loss coefficient of 0.07 at 150% strain), all within a single material. The dynamic covalent bonds enhance cohesive energy, ensuring high elasticity, while the non‐covalent bonds improve adhesive properties. As a proof of concept, the ionogel can be fabricated into a strain‐temperature dual‐modal e‐skin, exhibiting high sensitivity, reliability, and state‐independent performance. This advancement highlights the potential of ionogels in the development of next‐generation recyclable wearable electronic devices.

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Institutions

Publication Details

Journal
Advanced Functional Materials
Published
2025-03-20
DOI
https://doi.org/10.1002/adfm.202501677
Citations
8
Primary Topic
Advanced Sensor and Energy Harvesting Materials
Type
article
Field-Weighted Citation Impact
5.39

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article

Multifunctional Recyclable Electronic Skins Enabled by Hierarchical Dynamic Network Structures

Tianxi X. Liu, Xiaotong Fan, Xiaohui Yu, Jayven Chee Chuan Yeo et al.
8 citations
Advanced Functional Materials
Advanced Sensor and Energy Harvesting Materials
5.39
article

Multifunctional Recyclable Electronic Skins Enabled by Hierarchical Dynamic Network Structures

Tianxi X. Liu, Xiaotong Fan, Xiaohui Yu, Jayven Chee Chuan Yeo, Xiaoshan Fan, Zibiao Li, Choon Peng Teng
article en
8 citations

Abstract

Abstract Inspired by the sensory functions of the human skin, the development of electronic skins (e‐skins) has garnered significant attention. Ionogels, as an emerging class of soft materials, show promise in serving as e‐skins. The pursuit of a sustainable society motivates the development of recyclable ionogels, typically achieved by introducing dynamic non‐covalent bonds. However, these current state‐of‐the‐art methods often result in poor elasticity or strain softening, which significantly limits their suitability for e‐skin applications. This study introduces a multifunctional and recyclable e‐skin based on a hierarchical dynamic double‐network ionogel that integrates dynamic covalent bonds and non‐covalent interactions. This ionogel seamlessly integrates key functions of human skin, including strain‐stiffening capability, self‐healing ability within 12 h, rapid response time (120 ms), and high elasticity (energy loss coefficient of 0.07 at 150% strain), all within a single material. The dynamic covalent bonds enhance cohesive energy, ensuring high elasticity, while the non‐covalent bonds improve adhesive properties. As a proof of concept, the ionogel can be fabricated into a strain‐temperature dual‐modal e‐skin, exhibiting high sensitivity, reliability, and state‐independent performance. This advancement highlights the potential of ionogels in the development of next‐generation recyclable wearable electronic devices.

Advanced Functional MaterialsVol. 35(33)
Jiangnan University (CN), Agency for Science, Technology and Research (SG), National University of Singapore (SG), Donghua University (CN), Jiaxing University (CN), Université Bourgogne Franche-Comté (FR), Institute of Materials Research and Engineering (SG)
Agency for Science, Technology and Research
Openalex Percentile: Top 4%
Advanced Sensor and Energy Harvesting Materials
5.39
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