Recent advances in fiber-to-PIC packaging technologies for scalable manufacturing
We present a photonic packaging paradigm where the light from an edge coupler of a photonic integrated circuit is turned normal to the surface using a specially-manufactured silicon micro-lens equipped with an etched turning prism. Due to expansion of the beam, the alignment tolerances of coupling to similarly-equipped fiber array are significantly relaxed making it compatible with the future surface-mounted pluggable solutions. We demonstrate sub-2 dB coupling efficiency at 1310 nm from a transceiver chip.
Authors
- Wilfried Noell
- Sharon M. Butler (ORCID: https://orcid.org/0000-0001-6906-3470)
- Kevin Shortiss (ORCID: https://orcid.org/0000-0002-5249-7034)
- Kamil Gradkowski (ORCID: https://orcid.org/0000-0003-3405-6347)
- K.-O. Velthaus
- Seán Collins (ORCID: https://orcid.org/0000-0002-7728-8669)
- Haoran Wang (ORCID: https://orcid.org/0000-0002-8952-5131)
- Peter O’Brien (ORCID: https://orcid.org/0000-0003-3184-3759)
- Das Soumitra Kumar
- How Yuan Hwang (ORCID: https://orcid.org/0000-0002-8536-0974)
- G. Fiol
- José Luís Parra
Publication Details
- Published
- 2025-03-20
- DOI
- https://doi.org/10.1117/12.3042451
- Citations
- 3
- Primary Topic
- 3D IC and TSV technologies
- Type
- article
- Field-Weighted Citation Impact
- 2.19