Semiconductorisation of photonic chip packaging

This work presents a concept for photonic integrated circuit (PIC) packaging to address the urgent need for cost-effective and scalable solutions for high-volume manufacturing. The goal of this adaptation is to simplify assembly steps while enhancing accuracy and scalability using established semiconductor industry processes. The key technology building block discussed consists of an interposer with integrated electrical and optical redistribution layers on a glass substrate. Efficient optical interconnections between PICs and planar polymer waveguides based on evanescent coupling mechanisms are discussed, revealing the potential to achieve ultra-low coupling losses as low as 0.043dB at 1550nm. The modular and cost-effective approach merges photonic and semiconductor manufacturing technologies to enable next-generation HPC and data communication technologies.