VN–VIn divacancies as the origin of non-radiative recombination centers in InGaN quantum wells

In this paper, we investigate the nature of surface defects originating from the high-temperature (HT) GaN buffer and their incorporation into InGaN quantum wells (QWs) grown using the metalorganic vapor phase epitaxy technique. In particular, we conduct a detailed examination of the migration process of these defects from the HT-GaN buffer to the QWs, focusing on two potential pathways: diffusion versus surface segregation. A careful study confirms surface segregation as the dominant migration mechanism. To further understand the defect nature, we evaluate the stability of the HT-GaN surface under different annealing conditions, including different combinations of temperature and ammonia flow. We find that higher annealing temperatures or reduced ammonia flows significantly enhance the formation of defects, which speaks in favor of nitrogen vacancies (VN). Finally, we propose that these VN vacancies segregate toward the surface and interact with indium vacancies (VIn) in InGaN layers, forming VN–VIn divacancies. These VN–VIn divacancies could be the primary defects incorporated into InGaN layers acting as the main non-radiative recombination centers in InGaN QWs.

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Publication Details

Journal
APL Materials
Published
2025-03-01
DOI
https://doi.org/10.1063/5.0256650
Citations
2
Primary Topic
GaN-based semiconductor devices and materials
Type
article
Field-Weighted Citation Impact
2.52

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article

VN–VIn divacancies as the origin of non-radiative recombination centers in InGaN quantum wells

J.‐F. Carlin, Yao Chen, R. Butté, N. Grandjean et al.
2 citations
APL Materials
GaN-based semiconductor devices and materials
2.52
article

VN–VIn divacancies as the origin of non-radiative recombination centers in InGaN quantum wells

J.‐F. Carlin, Yao Chen, R. Butté, N. Grandjean, Anna Toschi
article en
2 citations

Abstract

In this paper, we investigate the nature of surface defects originating from the high-temperature (HT) GaN buffer and their incorporation into InGaN quantum wells (QWs) grown using the metalorganic vapor phase epitaxy technique. In particular, we conduct a detailed examination of the migration process of these defects from the HT-GaN buffer to the QWs, focusing on two potential pathways: diffusion versus surface segregation. A careful study confirms surface segregation as the dominant migration mechanism. To further understand the defect nature, we evaluate the stability of the HT-GaN surface under different annealing conditions, including different combinations of temperature and ammonia flow. We find that higher annealing temperatures or reduced ammonia flows significantly enhance the formation of defects, which speaks in favor of nitrogen vacancies (VN). Finally, we propose that these VN vacancies segregate toward the surface and interact with indium vacancies (VIn) in InGaN layers, forming VN–VIn divacancies. These VN–VIn divacancies could be the primary defects incorporated into InGaN layers acting as the main non-radiative recombination centers in InGaN QWs.

APL MaterialsVol. 13(3)
FZU ‒ Institute of Physics of the Academy of Sciences of the Czech Republic (CZ), École Polytechnique Fédérale de Lausanne (CH)
Schweizerischer Nationalfonds zur Förderung der Wissenschaftlichen Forschung
Openalex Percentile: Top 13%
GaN-based semiconductor devices and materials
2.52
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