Research on Hotspot Heat Dissipation Characteristics of Chips Based on Parallel Microfluidic Channel
In order to explore the heat dissipation effect of the microfluidic channel, this paper designs a parallel microfluidic channel structure, tests its microfluidic channel heat dissipation performance, and explores the influence of the fluid inlet flow rate and hotspot location on the heat dissipation effect. The results show that adding this structure in the heat sink can significantly reduce the upper surface temperature, and the location of hotspots also has a big impact on the heat dissipation effect, indicating that the parallel microfluidic channel has a better heat dissipation performance.
Authors
- Dazhi Ding (ORCID: https://orcid.org/0000-0001-8522-6233)
- Huaguang Bao (ORCID: https://orcid.org/0000-0001-9609-247X)
- Yutian Liu (ORCID: https://orcid.org/0000-0001-6932-5207)
- Yan Peng (ORCID: https://orcid.org/0000-0002-1115-2443)
- Tiancheng Zhang (ORCID: https://orcid.org/0009-0009-3449-2318)
Institutions
- Nanjing University of Science and Technology (CN)
Publication Details
- Published
- 2024-11-27
- DOI
- https://doi.org/10.1109/mape62875.2024.10924467
- Primary Topic
- Heat Transfer and Optimization
- Type
- article
- Field-Weighted Citation Impact
- 0.00
Funders
- National Natural Science Foundation of China
- Fundamental Research Funds for the Central Universities