Out-of-Plane Optical Coupling to Photonic Integrated Circuits Using Turning-Mirror Lens Arrays

We demonstrate an out-of-plane optical coupling between a photonic integrated circuit (PIC) and a fiber array (FA). The presented scheme utilizes a molded glass microlens with an integrated turning mirror. We show that by expanding the beam, the alignment tolerances between the fiber and PIC assemblies are expanded by an order of magnitude. The reported coupling losses of 2.1 dB per coupler are only limited by the optical design of the off-the-shelf micro-optics.

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Publication Details

Journal
IEEE Transactions on Components Packaging and Manufacturing Technology
Published
2025-03-19
DOI
https://doi.org/10.1109/tcpmt.2025.3552840
Primary Topic
Photonic and Optical Devices
Type
article
Field-Weighted Citation Impact
0.00

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article

Out-of-Plane Optical Coupling to Photonic Integrated Circuits Using Turning-Mirror Lens Arrays

Kamil Gradkowski, Peter O’Brien
5 links
IEEE Transactions on Components Packaging and Manufacturing Technology
Photonic and Optical Devices
article

Out-of-Plane Optical Coupling to Photonic Integrated Circuits Using Turning-Mirror Lens Arrays

Kamil Gradkowski, Peter O’Brien
article en

Abstract

We demonstrate an out-of-plane optical coupling between a photonic integrated circuit (PIC) and a fiber array (FA). The presented scheme utilizes a molded glass microlens with an integrated turning mirror. We show that by expanding the beam, the alignment tolerances between the fiber and PIC assemblies are expanded by an order of magnitude. The reported coupling losses of 2.1 dB per coupler are only limited by the optical design of the off-the-shelf micro-optics.

IEEE Transactions on Components Packaging and Manufacturing TechnologyVol. 15(8)
Science Foundation Ireland
Affordable and clean energy
Openalex Percentile: Top 96%
Photonic and Optical Devices
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