Enhanced dielectric properties of alternative NO-gas-based SiO<sub>2</sub> films <i>via</i> plasma-enhanced chemical vapor deposition for high-performance indium–gallium–zinc oxide thin-film transistors

The effects of N 2 annealing on dielectric properties of NO-based SiO 2 films fabricated through plasma-enhanced chemical vapor deposition and device performance of IGZO TFTs with them were investigated underlying the charge-transport mechanism.

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Publication Details

Journal
Journal of Materials Chemistry C
Published
2025-01-01
DOI
https://doi.org/10.1039/d5tc00213c
Citations
2
Primary Topic
Thin-Film Transistor Technologies
Type
article
Field-Weighted Citation Impact
1.46
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article

Enhanced dielectric properties of alternative NO-gas-based SiO2 films via plasma-enhanced chemical vapor deposition for high-performance indium–gallium–zinc oxide thin-film transistors

Tae‐Jun Ha, Youngjin Kang, Eunha Kim, Yong‐Hoon Kim et al.
2 citations
Journal of Materials Chemistry C
Thin-Film Transistor Technologies
1.46
article

Enhanced dielectric properties of alternative NO-gas-based SiO2 films via plasma-enhanced chemical vapor deposition for high-performance indium–gallium–zinc oxide thin-film transistors

Tae‐Jun Ha, Youngjin Kang, Eunha Kim, Yong‐Hoon Kim, Yunhui Jang, Se-Ryong Park, Junsin Yi
article en
2 citations

Abstract

The effects of N 2 annealing on dielectric properties of NO-based SiO 2 films fabricated through plasma-enhanced chemical vapor deposition and device performance of IGZO TFTs with them were investigated underlying the charge-transport mechanism.

Journal of Materials Chemistry CVol. 13(17)
Kwangwoon University (KR), Sungkyunkwan University (KR)
Openalex Percentile: Top 19%
Thin-Film Transistor Technologies
1.46
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