Photonic integrated circuits based on cubic silicon carbide

Silicon carbide (SiC) gains momentum as a platform for realizing diverse applications in integrated photonics across both classical and quantum areas. This work focuses on photonic integration based on cubic SiC (3C-SiC), epitaxially grown on silicon, which provides properties such as a wide bandgap, high refractive index, and isotropic crystal structure. The usage of post-fabrication thermal annealing can significantly reduce waveguide loss in suspended 3C-SiC, enhancing SiC crystallinity and surface smoothness. On SiC-on-insulator (SiCOI) platforms, a flip, bond, etch, and polish method removes stacking faults and anti-phase boundaries at the SiC and silicon interface. Experimental studies demonstrate photothermal nonlinear responses, including optical bi-stability in both suspended 3C-SiC and SiCOI resonators. By using a CMOS-foundry-compatible fabrication process, we achieve a thin-film SiC Electro-Optic (EO) modulator operating at high optical power without signal degradation. Moreover, Kerr nonlinearity studies highlight the platform's thermal stability and polarization-independent responses. Future improvements include reducing chip-to-fiber coupling and waveguide loss.

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Publication Details

Published
2025-03-19
DOI
https://doi.org/10.1117/12.3040899
Primary Topic
Photonic and Optical Devices
Type
article
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article

Photonic integrated circuits based on cubic silicon carbide

Xiaoke Yi, Marko Lončar
Photonic and Optical Devices
article

Photonic integrated circuits based on cubic silicon carbide

Xiaoke Yi, Marko Lončar
article en

Abstract

Silicon carbide (SiC) gains momentum as a platform for realizing diverse applications in integrated photonics across both classical and quantum areas. This work focuses on photonic integration based on cubic SiC (3C-SiC), epitaxially grown on silicon, which provides properties such as a wide bandgap, high refractive index, and isotropic crystal structure. The usage of post-fabrication thermal annealing can significantly reduce waveguide loss in suspended 3C-SiC, enhancing SiC crystallinity and surface smoothness. On SiC-on-insulator (SiCOI) platforms, a flip, bond, etch, and polish method removes stacking faults and anti-phase boundaries at the SiC and silicon interface. Experimental studies demonstrate photothermal nonlinear responses, including optical bi-stability in both suspended 3C-SiC and SiCOI resonators. By using a CMOS-foundry-compatible fabrication process, we achieve a thin-film SiC Electro-Optic (EO) modulator operating at high optical power without signal degradation. Moreover, Kerr nonlinearity studies highlight the platform's thermal stability and polarization-independent responses. Future improvements include reducing chip-to-fiber coupling and waveguide loss.

The University of Sydney (AU), Harvard University Press (US)
Affordable and clean energy
Openalex Percentile: Top 96%
Photonic and Optical Devices
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