Highly-efficient fiber-to-chip edge coupler for silicon carbide photonic integrated circuits

Silicon carbide (SiC) platform for integrated photonic circuits shows great promise due to its wide bandgap, low thermo-optic coefficient, and high thermal conductivity highlight. This paper presents a bilayer inversely tapered mode converter edge coupler on the cubic SiC-on-insulator platform. It effectively reduces fiber-to-chip coupling loss to below 0.5 dB across the full C and L bands, with high fabrication tolerances, enabling efficient interfacing between fibers and SiC photonic chips.

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Publication Details

Published
2025-03-19
DOI
https://doi.org/10.1117/12.3040942
Primary Topic
Photonic and Optical Devices
Type
article
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article

Highly-efficient fiber-to-chip edge coupler for silicon carbide photonic integrated circuits

R.A. Minasian, Romain Demur, Xiaoke Yi, Liwei Li et al.
Photonic and Optical Devices
article

Highly-efficient fiber-to-chip edge coupler for silicon carbide photonic integrated circuits

R.A. Minasian, Romain Demur, Xiaoke Yi, Liwei Li, Shijie Song
article en

Abstract

Silicon carbide (SiC) platform for integrated photonic circuits shows great promise due to its wide bandgap, low thermo-optic coefficient, and high thermal conductivity highlight. This paper presents a bilayer inversely tapered mode converter edge coupler on the cubic SiC-on-insulator platform. It effectively reduces fiber-to-chip coupling loss to below 0.5 dB across the full C and L bands, with high fabrication tolerances, enabling efficient interfacing between fibers and SiC photonic chips.

The University of Sydney (AU), Thales (France) (FR)
Affordable and clean energy
Openalex Percentile: Top 96%
Photonic and Optical Devices
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