Highly-efficient fiber-to-chip edge coupler for silicon carbide photonic integrated circuits
Silicon carbide (SiC) platform for integrated photonic circuits shows great promise due to its wide bandgap, low thermo-optic coefficient, and high thermal conductivity highlight. This paper presents a bilayer inversely tapered mode converter edge coupler on the cubic SiC-on-insulator platform. It effectively reduces fiber-to-chip coupling loss to below 0.5 dB across the full C and L bands, with high fabrication tolerances, enabling efficient interfacing between fibers and SiC photonic chips.
Authors
- R.A. Minasian (ORCID: https://orcid.org/0000-0002-0527-7282)
- Romain Demur (ORCID: https://orcid.org/0000-0002-6481-4762)
- Xiaoke Yi (ORCID: https://orcid.org/0000-0003-1477-5504)
- Liwei Li (ORCID: https://orcid.org/0000-0002-2887-4979)
- Shijie Song (ORCID: https://orcid.org/0000-0002-7227-5842)
Institutions
- The University of Sydney (AU)
- Thales (France) (FR)
Publication Details
- Published
- 2025-03-19
- DOI
- https://doi.org/10.1117/12.3040942
- Primary Topic
- Photonic and Optical Devices
- Type
- article
- Field-Weighted Citation Impact
- 0.00