Superconducting 2.5D interposer for quantum processors
With the increasing number of solid state-based qubits and functionality, superconducting interposer provides a platform for integration of qubit and control devices. Superconducting 2.5D interposer has been developed and fabricated in CMOS compatible advance packaging line. This development work leveraged the mature semiconductor technology. Transition temperature and critical current has been measured and reported in this paper.
Authors
- Naga Manikanta Kommanaboina (ORCID: https://orcid.org/0000-0001-5259-307X)
- Adrian Nugraha Utama (ORCID: https://orcid.org/0009-0005-0759-6753)
- Ding Huang (ORCID: https://orcid.org/0000-0002-1588-4967)
- Yiyu Zhang (ORCID: https://orcid.org/0000-0001-6033-5898)
- Yong Chyn Ng
- Kuan Eng Johnson Goh (ORCID: https://orcid.org/0000-0003-0599-9696)
- Norhanani Jaafar
- M. Mukherjee (ORCID: https://orcid.org/0000-0003-3706-406X)
- Hongyu Li (ORCID: https://orcid.org/0000-0002-3564-6069)
Institutions
- Agency for Science, Technology and Research (SG)
- Institute of Microelectronics (SG)
- Institute of Materials Research and Engineering (SG)
Publication Details
- Published
- 2025-03-19
- DOI
- https://doi.org/10.1117/12.3043199
- Primary Topic
- Semiconductor materials and devices
- Type
- article
- Field-Weighted Citation Impact
- 0.00