Simulation-Based Assessment of Vibration Effects on IGBT Module Lifetime in Wind Turbines Through Modal and Random Vibration Analysis

This study explores the effect of vibrations generated by wind turbines on the lifespan of the IGBT module. Since wind turbines operate under varying dynamic loads, they produce vibrations that might influence the performance and longevity of electronic components like IGBTs. To investigate this concern, a modal analysis was carried out using the finite element analysis (FEA) in ANSYS to identify the natural frequencies of the module. These frequencies were then compared with typical load frequencies encountered in wind turbine operations. Furthermore, random vibration analysis, incorporating power spectral density (PSD), was conducted to assess the module’s deformation under stochastic vibration conditions. The simulation results demonstrated that the IGBT module located inside the wind turbine nacelle has an exceptionally long operational lifetime under random vibration conditions. This indicates that the impact of vibrations on the module’s durability is minimal. As a result, this study concludes that vibrations induced by wind turbine operations pose no significant threat to the lifespan of the IGBT module, reinforcing its reliability in power electronic systems, even in vibration-prone environments.