Overcoming Ambient Drift and Negative-Bias Temperature Instability in Foundry Carbon Nanotube Transistors

Carbon nanotube field-effect transistors (CNFETs) are promising candidates for back-end-of-line logic integration as a complementary path for continued electronic scaling. However, overcoming CNFET ambient drift (i.e., air stability) and reliability is underexplored. Here, we demonstrate that silicon nitride encapsulation limits ambient atmosphere-induced threshold voltage shift (∼8× reduction of median Δ<i>V</i><sub>T</sub> over 90 days). With stabilized nitride-encapsulated CNFETs, we characterize CNFET negative bias temperature instability (NBTI) with both DC and AC stress across the electric field, temperature, gate oxide thickness, and stress frequency. AC pulsed operation significantly improves CNFET NBTI vs DC operation across a wide frequency range of 1 kHz-10 MHz. A 20% duty cycle AC operation at 10 MHz could extend the NBTI time to failure by > 10<sup>4</sup>× vs DC for a target |Δ<i>V</i><sub>T</sub>| tolerance ≤100 mV with a gate bias <i>V</i><sub>GS,Stress</sub> = -1.2 V at 125 °C. This work improves our understanding of overcoming ambient drift and BTI reliability in CNFETs.

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Publication Details

Journal
ACS Applied Materials & Interfaces
Published
2025-03-18
DOI
https://doi.org/10.1021/acsami.4c22130
Citations
2
Primary Topic
Semiconductor materials and devices
Type
article
Field-Weighted Citation Impact
1.46

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article

Overcoming Ambient Drift and Negative-Bias Temperature Instability in Foundry Carbon Nanotube Transistors

Tathagata Srimani, Andrew Yu, Max M. Shulaker
2 citations
ACS Applied Materials & Interfaces
Semiconductor materials and devices
1.46
article

Overcoming Ambient Drift and Negative-Bias Temperature Instability in Foundry Carbon Nanotube Transistors

Tathagata Srimani, Andrew Yu, Max M. Shulaker
article en
2 citations

Abstract

Carbon nanotube field-effect transistors (CNFETs) are promising candidates for back-end-of-line logic integration as a complementary path for continued electronic scaling. However, overcoming CNFET ambient drift (i.e., air stability) and reliability is underexplored. Here, we demonstrate that silicon nitride encapsulation limits ambient atmosphere-induced threshold voltage shift (∼8× reduction of median Δ<i>V</i><sub>T</sub> over 90 days). With stabilized nitride-encapsulated CNFETs, we characterize CNFET negative bias temperature instability (NBTI) with both DC and AC stress across the electric field, temperature, gate oxide thickness, and stress frequency. AC pulsed operation significantly improves CNFET NBTI vs DC operation across a wide frequency range of 1 kHz-10 MHz. A 20% duty cycle AC operation at 10 MHz could extend the NBTI time to failure by > 10<sup>4</sup>× vs DC for a target |Δ<i>V</i><sub>T</sub>| tolerance ≤100 mV with a gate bias <i>V</i><sub>GS,Stress</sub> = -1.2 V at 125 °C. This work improves our understanding of overcoming ambient drift and BTI reliability in CNFETs.

ACS Applied Materials & InterfacesVol. 17(13)
Analog Devices (United States) (US), Massachusetts Institute of Technology (US), Carnegie Mellon University (US), Stanford University (US)
National Science Foundation, U.S. Department of Defense, Analog Devices, Defense Sciences Office, DARPA
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Openalex Percentile: Top 19%
Semiconductor materials and devices
1.46
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Overcoming Ambient Drift and Negative-Bias Temperature Instability in Foundry Carbon Nanotube Transistors — Tathagata Srimani, Andrew Yu, et al. · ACS Applied Materials & Interfaces (2025) | TGRS Research Map | TGRS