Corrosion Behavior of (Copper/Nickel) step-wise Functionally Graded Materials

The present paper involves studying of the corrosion behaviour of five layers Cu/Ni Functionally Graded Materials (FGMs) in a 3.5 % NaCl solution to examine corrosion potentials (Ecorr.), corrosion current densities (icorr.) and Tafel slope. Three series of FGMs samples, labeled A1-A6, B1-B6, and C1-C6 were prepared using different experimental conditions of compaction pressure (0.7, 1 and 1.3 MPa), sintering temperature (650, 750 and 850oC) and sintering time (1 and 2 hours). The polarisation method was conducted at 3 mV/s of a scan rate, and room temperature. According into the potentiodynamic polarization test, it was found that the sintering time of 2 hrs at constant temperature, and pressure enhances the corrosion potential towards stabilization the protective surface layer. A3, A4 are samples designation corresponding to different experimental settings determined by design of experiments. Corrosion current density measurements showed that A4 sample had the highest (673.20 μA/cm²), while A3 sample had the lowest icorr (0.8508 μA/cm²). Tafel slope analysis revealed that A3 sample had the highest anodic, and cathodic slopes, and was associated with the lowest corrosion rate. The corrosion resistance (Rp) data supported these results, with A3 showing the highest resistance, confirming its superior corrosion resistance (Rp). This behaviour may be related into the noble properties of copper, and the protection of cupric oxide (CuO) compared to (NiO).

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Publication Details

Journal
Archives of Foundry Engineering
Published
2025-03-17
DOI
https://doi.org/10.24425/afe.2025.153777
Citations
1
Primary Topic
Copper Interconnects and Reliability
Type
article
Field-Weighted Citation Impact
0.43
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article

Corrosion Behavior of (Copper/Nickel) step-wise Functionally Graded Materials

Dhuha Albusalih, Alaa Abdulhasan Atiyah, Dheya Abdulamer, Noor Sh Ghafil
1 citations
Archives of Foundry Engineering
Copper Interconnects and Reliability
0.43
article

Corrosion Behavior of (Copper/Nickel) step-wise Functionally Graded Materials

Dhuha Albusalih, Alaa Abdulhasan Atiyah, Dheya Abdulamer, Noor Sh Ghafil
article en
1 citations

Abstract

The present paper involves studying of the corrosion behaviour of five layers Cu/Ni Functionally Graded Materials (FGMs) in a 3.5 % NaCl solution to examine corrosion potentials (Ecorr.), corrosion current densities (icorr.) and Tafel slope. Three series of FGMs samples, labeled A1-A6, B1-B6, and C1-C6 were prepared using different experimental conditions of compaction pressure (0.7, 1 and 1.3 MPa), sintering temperature (650, 750 and 850oC) and sintering time (1 and 2 hours). The polarisation method was conducted at 3 mV/s of a scan rate, and room temperature. According into the potentiodynamic polarization test, it was found that the sintering time of 2 hrs at constant temperature, and pressure enhances the corrosion potential towards stabilization the protective surface layer. A3, A4 are samples designation corresponding to different experimental settings determined by design of experiments. Corrosion current density measurements showed that A4 sample had the highest (673.20 μA/cm²), while A3 sample had the lowest icorr (0.8508 μA/cm²). Tafel slope analysis revealed that A3 sample had the highest anodic, and cathodic slopes, and was associated with the lowest corrosion rate. The corrosion resistance (Rp) data supported these results, with A3 showing the highest resistance, confirming its superior corrosion resistance (Rp). This behaviour may be related into the noble properties of copper, and the protection of cupric oxide (CuO) compared to (NiO).

Archives of Foundry Engineering
University of Technology - Iraq (IQ), University of Al-Qadisiyah (IQ), Ministry of Higher Education and Scientific Research (IQ)
Openalex Percentile: Top 44%
Copper Interconnects and Reliability
0.43
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Corrosion Behavior of (Copper/Nickel) step-wise Functionally Graded Materials — Dhuha Albusalih, Alaa Abdulhasan Atiyah, et al. · Archives of Foundry Engineering (2025) | TGRS Research Map | TGRS