De-coppering of Metallurgical Slag Using Printed Circuit Boards as a Reducer

In the publication of the results of laboratory tests for decoppering metallurgical slag using a variable addition of "LOW GRADE" PCB scrap as a reducer (dates from 10 to 30% of the slag mass). In practical devices, as well as research on decoppering metallurgical slag using coke - a currently used reducer. The tests involved four measurement series differing in the source of the reducer and the variable process involved. The process was carried out at temperatures of 1350 and 1450°C. Two measurements were taken for each variant analysed. The conducted research showed the possibility of effective use of printed circuit board scrap in the slag decoppering process. An additional advantage of its use was the introduction of an additional charge of copper into the process at an average level of 10% by mass, which was recovered during the process in the form of a metal alloy. The metal alloy formed during the slag reduction process acted as a collector for the copper contained in the PCB scrap. Research has shown that as the amount of reducer in the form of PCB scrap increases, the final Cu content in the slag after reduction increases. The highest average degree of slag decopperization was achieved when 10% of PCB scrap was added to the reduction. At the analyzed temperatures it ranged from 95.2 to 97.5%. When coke was used as a reducing agent at a temperature of 1350°C, the average degree of slag decopperization was from about 60 (2 h) to about 75.5% (4 h). Increasing the process temperature to 1450°C resulted in a significant increase in the slag decopperization rate, above 97%, regardless of the process duration.

Authors

Institutions

Publication Details

Journal
Archives of Foundry Engineering
Published
2025-03-17
DOI
https://doi.org/10.24425/afe.2025.153784
Primary Topic
Materials Engineering and Processing
Type
article
Field-Weighted Citation Impact
0.00
Controls
|||
ALL TIME
JAN
FEB
MAR
APR
MAY
JUN
JUL
AUG
SEP
OCT
article

De-coppering of Metallurgical Slag Using Printed Circuit Boards as a Reducer

Jerzy Łabaj, Piotr Madej, Łukasz Kortyka, Tomasz Matuła et al.
Archives of Foundry Engineering
Materials Engineering and Processing
article

De-coppering of Metallurgical Slag Using Printed Circuit Boards as a Reducer

Jerzy Łabaj, Piotr Madej, Łukasz Kortyka, Tomasz Matuła, Łukasz Myćka, Marta Lewandowska
article en

Abstract

In the publication of the results of laboratory tests for decoppering metallurgical slag using a variable addition of "LOW GRADE" PCB scrap as a reducer (dates from 10 to 30% of the slag mass). In practical devices, as well as research on decoppering metallurgical slag using coke - a currently used reducer. The tests involved four measurement series differing in the source of the reducer and the variable process involved. The process was carried out at temperatures of 1350 and 1450°C. Two measurements were taken for each variant analysed. The conducted research showed the possibility of effective use of printed circuit board scrap in the slag decoppering process. An additional advantage of its use was the introduction of an additional charge of copper into the process at an average level of 10% by mass, which was recovered during the process in the form of a metal alloy. The metal alloy formed during the slag reduction process acted as a collector for the copper contained in the PCB scrap. Research has shown that as the amount of reducer in the form of PCB scrap increases, the final Cu content in the slag after reduction increases. The highest average degree of slag decopperization was achieved when 10% of PCB scrap was added to the reduction. At the analyzed temperatures it ranged from 95.2 to 97.5%. When coke was used as a reducing agent at a temperature of 1350°C, the average degree of slag decopperization was from about 60 (2 h) to about 75.5% (4 h). Increasing the process temperature to 1450°C resulted in a significant increase in the slag decopperization rate, above 97%, regardless of the process duration.

Archives of Foundry Engineering
Silesian University of Technology (PL), Łukasiewicz Research Network - Institute of Non-Ferrous Metals (PL), Łukasiewicz Research Network (PL)
Openalex Percentile: Top 95%
Materials Engineering and Processing
AI Navigator

Ask Laika to Summarize, Analyze, and Connect papers live on the map.

Summarize Papers & Methodologies

Extract key findings, datasets, and comparative methods across publications.

Benchmark Rankings & Visual Analytics

Rank top research institutions, authors, funders, topics, and journals by Field-Weighted Citation Impact (FWCI) and paper volume with instant charts.

Connect Distant Disciplines

Bridge topological clusters on the map to find hidden collaborative intersections.