Promoting Room-Temperature n-type Bismuth Telluride Thermoelectrics via High-Potential Barrier Heterointerfaces
The donor effect of polycrystalline n-type bismuth telluride (Bi<sub>2</sub>Te<sub>3</sub>) during sample preparation usually results in the peak thermoelectric figure of merit (ZT) at temperatures above 400 K, severely restricting its application in the room-temperature (RT) range. A leap in RT performance requires innovative strategies that replace conventional methods of regulating point defects with limited effectiveness. We demonstrate excellent thermoelectric performance with an RT figure of merit, ZT = 1.2, and a maximum ZT = 1.3 at 325 K, by regulating the high-potential barrier heterointerfaces composed of La<sub>2</sub>O<sub>3</sub> nanoparticles (NPs) and Bi<sub>2</sub>Te<sub>2.7</sub>Se<sub>0.3</sub> (BTS). The created energy barriers at grain boundaries scatter and localize carriers through O-Bi ionic bonding and O-Te hybridization, enhancing the density of states in adjacent regions and leading to a rapid rise in the RT Seebeck coefficient (from 148.67 μV K<sup>-1</sup> to 222.84 μV K<sup>-1</sup> at 300 K). Another aspect of La<sub>2</sub>O<sub>3</sub> NPs, as the second term of nano-oxide, introduces multiscale defect-scattering phonons, thereby enhancing thermal performance. Finally, at temperature difference <i>ΔT</i> = 10 K, a maximum output voltage and power, <i>V</i><sub>max</sub> = 239.73 mV and <i>P</i><sub>max</sub>= 10.50 mW, can be achieved with the fabricated TE module. Our findings underscore the full potential for promoting the performance of thermoelectric materials in the lower temperature region via high-energy barrier interface engineering.
Authors
- Pingping Qian
- Qiang Sun (ORCID: https://orcid.org/0000-0001-5328-7605)
- Guang‐Kun Ren (ORCID: https://orcid.org/0000-0002-4139-3010)
- Yixiao Deng
- Zhengshang Wang (ORCID: https://orcid.org/0000-0002-8257-6729)
- Lei Yang (ORCID: https://orcid.org/0000-0003-3284-5617)
- Kaiyi Luo (ORCID: https://orcid.org/0000-0002-5059-296X)
- An Li (ORCID: https://orcid.org/0000-0002-7626-6812)
- Hao Chen (ORCID: https://orcid.org/0009-0001-6480-7976)
- Qian Cao
- Jun Tang (ORCID: https://orcid.org/0000-0001-6766-4889)
- Yuquan Liu (ORCID: https://orcid.org/0009-0009-3768-6054)
Institutions
- University of Electronic Science and Technology of China (CN)
- Sichuan University (CN)
- China Academy of Engineering Physics (CN)
- West China Hospital of Sichuan University (CN)
Publication Details
- Journal
- ACS Applied Materials & Interfaces
- Published
- 2025-03-17
- DOI
- https://doi.org/10.1021/acsami.5c01400
- Citations
- 2
- Primary Topic
- Advanced Thermoelectric Materials and Devices
- Type
- article
- Field-Weighted Citation Impact
- 1.04