Threshold Voltage Hysteresis and Gate Leakage in AlGaN/GaN HEMTs

Temperature-dependent threshold voltage (<inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$V_{\mathrm {TH}}$ </tex-math></inline-formula>) hysteresis and gate leakage current are characterized in commercial AlGaN/GaN high electron mobility transistors (HEMTs). Significant peaks in <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$V_{\mathrm {TH}}$ </tex-math></inline-formula> hysteresis are observed at <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$220 \; \pm \; 10$ </tex-math></inline-formula> K. Gate leakage current increases with increasing temperature for as-processed devices and devices irradiated with 1.8-MeV protons at <sc xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">off</small>-state bias, due to Mott hopping. In contrast, gate leakage current for devices irradiated or stressed at <sc xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">on</small>-bias increases strongly with decreasing temperature below 200 K. The increased gate leakage at low temperatures and large negative bias in <sc xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">on</small>-bias stressed and/or irradiated devices is attributed primarily to trap-assisted tunneling through oxygen impurities (ON) in AlGaN. Dehydrogenation of ON-H impurity centers during stress and/or <sc xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">on</small>-bias irradiation evidently plays a key role in enhanced cryogenic gate leakage at large negative bias in these devices.

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Publication Details

Journal
IEEE Transactions on Nuclear Science
Published
2025-03-14
DOI
https://doi.org/10.1109/tns.2025.3551268
Citations
3
Primary Topic
GaN-based semiconductor devices and materials
Type
article
Field-Weighted Citation Impact
3.77

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article

Threshold Voltage Hysteresis and Gate Leakage in AlGaN/GaN HEMTs

En Xia Zhang, Xuyi Luo, Ronald D. Schrimpf, Michael W. McCurdy et al.
3 citations
IEEE Transactions on Nuclear Science
GaN-based semiconductor devices and materials
3.77
article

Threshold Voltage Hysteresis and Gate Leakage in AlGaN/GaN HEMTs

En Xia Zhang, Xuyi Luo, Ronald D. Schrimpf, Michael W. McCurdy, Daniel M. Fleetwood, Hao Qiu, Xun Li, Pengfei Wang, Xiongce Zhao
article en
3 citations

Abstract

Temperature-dependent threshold voltage (<inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$V_{\mathrm {TH}}$ </tex-math></inline-formula>) hysteresis and gate leakage current are characterized in commercial AlGaN/GaN high electron mobility transistors (HEMTs). Significant peaks in <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$V_{\mathrm {TH}}$ </tex-math></inline-formula> hysteresis are observed at <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$220 \; \pm \; 10$ </tex-math></inline-formula> K. Gate leakage current increases with increasing temperature for as-processed devices and devices irradiated with 1.8-MeV protons at <sc xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">off</small>-state bias, due to Mott hopping. In contrast, gate leakage current for devices irradiated or stressed at <sc xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">on</small>-bias increases strongly with decreasing temperature below 200 K. The increased gate leakage at low temperatures and large negative bias in <sc xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">on</small>-bias stressed and/or irradiated devices is attributed primarily to trap-assisted tunneling through oxygen impurities (ON) in AlGaN. Dehydrogenation of ON-H impurity centers during stress and/or <sc xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">on</small>-bias irradiation evidently plays a key role in enhanced cryogenic gate leakage at large negative bias in these devices.

IEEE Transactions on Nuclear ScienceVol. 72(8)
University of Central Florida (US), Vanderbilt University (US), Western Digital (United States) (US)
Air Force Office of Scientific Research
Openalex Percentile: Top 8%
GaN-based semiconductor devices and materials
3.77
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