Towards Industrialized E-Textile Assembly: Low Temperature Optimization of Textile-Electronic NCA Bonding

Developing an industrially viable interconnection process for integrating electronic modules in textiles at low temperatures could represent a key technology for the efficient and cost-effective industrial production of electronic textiles (e-textiles). The challenge lies in identifying and characterizing adhesive films that can ensure reliable adhesion between printed circuit board (PCB) material and textiles at processing temperatures below 130°C. This lower process temperature prevents damage to the textile fibers and deformation of common circuit board material, maintains the integrity and functionality of the final product, leads to higher reliability of electrical connections and benefits sustainability by reducing the energy needed for processing.