An experimental study on the thermal performance on electronic cooling using BatiX heatsink-PCM

Abstract Increasing computational capabilities and the miniaturization of computer devices have led to an increase in heat flux, which can result in a decrease in the lifespan of CPUs. In fact, 55% of CPU failures are caused by excessive heat. This has driven research in CPU heat dissipation. This experimental study utilizes a Parangkusumo batik-inspired heatsink design, with copper as the material, manufactured using 3D Printing metal. Additionally, the experiment combines the BatiX heatsink with PCM RT 35, injected into the heatsink to enhance heat dissipation. The experiment in-volves varying the heat load, air temperature, and airflow velocity to assess the heat dissipation performance at higher temperatures and determine the Nusselt correlation on the BatiX heatsink fins. The findings demonstrates that the addition of PCM can reduce CPU surface temperature by up to 8% and increase the setpoint time within the range of 5-10%.