Ion Radiation Effects on the Stability of Hafnium Oxide-Based Ferroelectric Thin Films: Mechanisms and Regulation

With the advancement of information technology, ferroelectric memories have garnered significant attention due to their non-volatility, high theoretical storage density, low power consumption, and excellent radiation resistance. Hafnium oxide-based ferroelectric materials have a high dielectric constant, a relatively wide bandgap, and good compatibility with CMOS processes, making them suitable for developing the next generation of ferroelectric memories. However, the stability issues hafnium oxide-based ferroelectric thin films face during service, including the wake-up effect and poor polarization retention, hinder the commercialization process of hafnium oxide-based ferroelectric memories developed from these thin films. This paper explores the possibility of optimizing the stability issues of HfO2-based ferroelectric thin films through ion irradiation based on a phase-field model of hafnium oxide-based ferroelectric thin films. The research results show that ion irradiation can effectively weaken the wake-up effect and improve the retention of the thin films. After irradiation with H, He, Fe, and Ar ions, the increase in remanent polarization values of HfO2-based ferroelectric thin films after wake-up was significantly reduced compared to the increase observed in non-irradiated films. Among them, the thin films irradiated with Ar ions showed the smallest increase in remanent polarization after wake-up, at only 9%, while the non-irradiated films exhibited a much higher increase of 260%. Additionally, the ten-year polarization retention efficiencies of the films post-irradiation were also excellent, reaching 95.2%, 93.3%, 92.7%, and 94.5% for H, He, Fe, and Ar ions, respectively. Since Ar ions most effectively reduce the wake-up effect and enhance polarization retention, this study recommends using Ar ions to optimize the stability of hafnium oxide-based ferroelectric thin films. This study provides new insights into optimizing HfO2-based ferroelectric thin films and explores their potential applications in ferroelectric memories.

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Journal
IEEE Transactions on Device and Materials Reliability
Published
2025-03-13
DOI
https://doi.org/10.1109/tdmr.2025.3550950
Citations
1
Primary Topic
Ferroelectric and Negative Capacitance Devices
Type
article
Field-Weighted Citation Impact
0.73

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article

Ion Radiation Effects on the Stability of Hafnium Oxide-Based Ferroelectric Thin Films: Mechanisms and Regulation

Limei Jiang, Jiawei Liu, Yujie Fan, Jie Jiang
1 citations
IEEE Transactions on Device and Materials Reliability
Ferroelectric and Negative Capacitance Devices
0.73
article

Ion Radiation Effects on the Stability of Hafnium Oxide-Based Ferroelectric Thin Films: Mechanisms and Regulation

Limei Jiang, Jiawei Liu, Yujie Fan, Jie Jiang
article en
1 citations

Abstract

With the advancement of information technology, ferroelectric memories have garnered significant attention due to their non-volatility, high theoretical storage density, low power consumption, and excellent radiation resistance. Hafnium oxide-based ferroelectric materials have a high dielectric constant, a relatively wide bandgap, and good compatibility with CMOS processes, making them suitable for developing the next generation of ferroelectric memories. However, the stability issues hafnium oxide-based ferroelectric thin films face during service, including the wake-up effect and poor polarization retention, hinder the commercialization process of hafnium oxide-based ferroelectric memories developed from these thin films. This paper explores the possibility of optimizing the stability issues of HfO2-based ferroelectric thin films through ion irradiation based on a phase-field model of hafnium oxide-based ferroelectric thin films. The research results show that ion irradiation can effectively weaken the wake-up effect and improve the retention of the thin films. After irradiation with H, He, Fe, and Ar ions, the increase in remanent polarization values of HfO2-based ferroelectric thin films after wake-up was significantly reduced compared to the increase observed in non-irradiated films. Among them, the thin films irradiated with Ar ions showed the smallest increase in remanent polarization after wake-up, at only 9%, while the non-irradiated films exhibited a much higher increase of 260%. Additionally, the ten-year polarization retention efficiencies of the films post-irradiation were also excellent, reaching 95.2%, 93.3%, 92.7%, and 94.5% for H, He, Fe, and Ar ions, respectively. Since Ar ions most effectively reduce the wake-up effect and enhance polarization retention, this study recommends using Ar ions to optimize the stability of hafnium oxide-based ferroelectric thin films. This study provides new insights into optimizing HfO2-based ferroelectric thin films and explores their potential applications in ferroelectric memories.

IEEE Transactions on Device and Materials ReliabilityVol. 25(2)
Xiangtan University (CN)
National Natural Science Foundation of China
Openalex Percentile: Top 31%
Ferroelectric and Negative Capacitance Devices
0.73
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