Device edge termination effects on TDDB in galvanic isolators based on polymeric dielectrics

We present an investigation on the impact of device edge termination on Time-Dependent Dielectric Breakdown (TDDB) in galvanic isolators based on polymeric dielectrics. By means of experimental and numerical analyses, we highlight that electrode thickness and device passivation are important design elements to limit the impact of electric field intensification at device on TDDB and prolong device lifetime. Results point out key aspects to consider to push the performance and the reliability of modern galvanic isolators to their ultimate limits. • Electric field intensification at device edge can worsen TDDB in galvanic isolators. • Design of device edge termination is critical for galvanic isolators reliability. • Electrode thickening and passivation improve the TDDB lifetime of galvanic isolators.

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Publication Details

Journal
Microelectronics Reliability
Published
2025-03-12
DOI
https://doi.org/10.1016/j.microrel.2025.115670
Citations
1
Primary Topic
High voltage insulation and dielectric phenomena
Type
article
Field-Weighted Citation Impact
0.52
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article

Device edge termination effects on TDDB in galvanic isolators based on polymeric dielectrics

M. Lauria, Donata Asnaghi, Alessandro S. Spinelli, J. L. Mazzola et al.
1 citations
Microelectronics Reliability
High voltage insulation and dielectric phenomena
0.52
article

Device edge termination effects on TDDB in galvanic isolators based on polymeric dielectrics

M. Lauria, Donata Asnaghi, Alessandro S. Spinelli, J. L. Mazzola, Francesco Guzzi, M. Greatti, Christian Monzio Compagnoni, F. Speroni, Dario Paci, Gerardo Malavena, Marco Salina, Vincenzo Marano, Lorenzo Cantù
article en
1 citations

Abstract

We present an investigation on the impact of device edge termination on Time-Dependent Dielectric Breakdown (TDDB) in galvanic isolators based on polymeric dielectrics. By means of experimental and numerical analyses, we highlight that electrode thickness and device passivation are important design elements to limit the impact of electric field intensification at device on TDDB and prolong device lifetime. Results point out key aspects to consider to push the performance and the reliability of modern galvanic isolators to their ultimate limits. • Electric field intensification at device edge can worsen TDDB in galvanic isolators. • Design of device edge termination is critical for galvanic isolators reliability. • Electrode thickening and passivation improve the TDDB lifetime of galvanic isolators.

Microelectronics ReliabilityVol. 168
STMicroelectronics (Czechia) (CZ), STMicroelectronics (Italy) (IT), Politecnico di Milano (IT)
Affordable and clean energy
Openalex Percentile: Top 41%
High voltage insulation and dielectric phenomena
0.52
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Device edge termination effects on TDDB in galvanic isolators based on polymeric dielectrics — M. Lauria, Donata Asnaghi, et al. · Microelectronics Reliability (2025) | TGRS Research Map | TGRS