ANALYSIS OF INTERMETALLIC FORMATION IN A MULTICOMPONENT AL-CU-NI-TA ALLOY SOLIDIFIED IN AN UPWARD DIRECTIONAL DEVICE

Understanding the influence of thermal parameters on the formation of microstructure and intermetallics in alloys obtained through solidification is crucial for enhancing the engineering properties of both extensively studied materials and new materials. This study aimed to identify the intermetallics formed during the solidification of the multicomponent alloy Al-33%Cu-1%Ni-1.2%Ta using a directional solidification device. Characterization was conducted through metallography, followed by scanning electron microscopy (SEM) analysis. Micrographs were obtained from representative regions where intermetallics were identified, and measurements were taken of the lamellar spacings of Al2Cu (λL1), the area of the star-shaped intermetallic, and the lamellar spacing of the eutectic surrounding the star (λL2) to correlate with the cooling rate. The results indicated that the cooling rate significantly influences the measured spacings and the area of the star-shaped intermetallic, as well as the relationship of the Al2Cu intermetallic found in this study compared to those in similar alloy systems.