Ultra-Thin ta-C Hermetic Seals for Electronics Packaging

The increasing demand for compact high-performance electronic devices necessitates the development of advanced materials that are capable of providing effective hermetic sealing. Tetrahedral Amorphous Carbon (ta-C) deposited by Filtered Cathodic Vacuum Arc (FCVA) has garnered attention as a promising alternative because of its exceptional barrier characteristics, mechanical durability, and optical properties. This paper presents a comprehensive analysis of ta-C attributes as an encapsulating material [1], supported by empirical evidence, and investigates its potential application in protecting electronic components. The research demonstrated that ta-C coatings exhibited minimal changes in resistance under elevated humidity and temperature conditions (85% RH, 85°C) for up to 792 h, with Set 1 samples displaying less than 5% variation in electrical resistance. The ta-C films also achieved an adhesion rating of ASTM 5B on both silicon and glass substrates. Water contact angle measurements revealed hydrophilicity with an average angle of 73.84° on silicon, further corroborating the suitability of the material for hermetic sealing applications.