Thermal Cycling Performance of Heterogeneous Sn-Ag-Cu Solder Joint with Minor Elements Addition
Coarse intermetallic compound (IMC) formation can lead to brittleness and generate cracks between the solder and the IMC interface under printed circuit board (PCB) warpage. Microstructure of the solder joint is closely related to its thermo-mechanical properties. Thus, it is essential to control the microstructure of the solder joint. Ball grid array (BGA) packages with 300 μm diameter Sn-3.0Ag-0.5Cu (SAC305) and Sn-2.5Ag-0.8Cu-0.05Ni-1.0Bi (SAC <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$(-\text{Ni}, \text{Bi}))$</tex> solder balls were soldered with SAC305 solder paste on the PCB coupon. These combinations of homogeneous (SAC305 solder ball and paste) and heterogeneous (SAC(- Ni,Bi) solder ball and SAC305 paste) solder joints were prepared to compare solder joint reliability.
Authors
- Mi-Song Kim (ORCID: https://orcid.org/0000-0002-4717-9365)
- Joo Young Bae (ORCID: https://orcid.org/0009-0008-6996-2714)
- Won Sik Hong (ORCID: https://orcid.org/0000-0001-8398-177X)
- Sehoon Yoo (ORCID: https://orcid.org/0000-0001-7036-6188)
- Namhyun Kang (ORCID: https://orcid.org/0000-0002-9460-5128)
- Jeong Tak Moon
- Seungbae Park (ORCID: https://orcid.org/0000-0001-8498-266X)
Institutions
- Korea Electronics Technology Institute (KR)
- Pusan National University (KR)
- Korea Institute of Industrial Technology (KR)
Publication Details
- Published
- 2024-12-03
- DOI
- https://doi.org/10.1109/eptc62800.2024.10909782
- Primary Topic
- Electronic Packaging and Soldering Technologies
- Type
- article
- Field-Weighted Citation Impact
- 0.00