Cost-Performance Co-Optimization for the Chiplet Era

Chiplet technologies allow for greater flexibility in system design through a wide range of system configuration options spanning integration schemes (monolithic, 2.5D, 3D), heterogeneity in technology nodes, and partitioning of system resources. Each such configuration has implications on figures of merit such as cost, power and performance. Optimizing for one metric may come at the expense of the other two. During the initial architecture exploration and design planning stage, it is critical to conduct cost-performance co-optimization using models that cover the entire spectrum of configuration options to make an informed choice. This work presents an evaluation using a framework that models both cost and performance simultaneously for chiplet-based systems, enabling analysis of the impact of various system-wide architectural configurations. We analyze a representative scale-out system for high-performance computing workloads to investigate how factors like integration, partitioning, technology node choices, and system size affect power, performance, and cost. The results demonstrate that the optimal design choices vary depending on these factors, highlighting the insights early stage chiplet design space exploration can offer.

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Publication Details

Published
2024-12-03
DOI
https://doi.org/10.1109/eptc62800.2024.10909776
Citations
5
Primary Topic
3D IC and TSV technologies
Type
article
Field-Weighted Citation Impact
1.04

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article

Cost-Performance Co-Optimization for the Chiplet Era

Vinay Kumar, Nicolas Pantano, Alexander Graening, Giuliano Sisto et al.
5 citations
3D IC and TSV technologies
1.04
article

Cost-Performance Co-Optimization for the Chiplet Era

Vinay Kumar, Nicolas Pantano, Alexander Graening, Giuliano Sisto, Puneet Gupta, Manu Perumkunnil, Dipen Vasudev Patel, Arindam Mallik, Erwan Lenormand
article en
5 citations

Abstract

Chiplet technologies allow for greater flexibility in system design through a wide range of system configuration options spanning integration schemes (monolithic, 2.5D, 3D), heterogeneity in technology nodes, and partitioning of system resources. Each such configuration has implications on figures of merit such as cost, power and performance. Optimizing for one metric may come at the expense of the other two. During the initial architecture exploration and design planning stage, it is critical to conduct cost-performance co-optimization using models that cover the entire spectrum of configuration options to make an informed choice. This work presents an evaluation using a framework that models both cost and performance simultaneously for chiplet-based systems, enabling analysis of the impact of various system-wide architectural configurations. We analyze a representative scale-out system for high-performance computing workloads to investigate how factors like integration, partitioning, technology node choices, and system size affect power, performance, and cost. The results demonstrate that the optimal design choices vary depending on these factors, highlighting the insights early stage chiplet design space exploration can offer.

University of California, Los Angeles (US), IMEC (BE)
National Science Foundation
Openalex Percentile: Top 22%
3D IC and TSV technologies
1.04
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Cost-Performance Co-Optimization for the Chiplet Era — Vinay Kumar, Nicolas Pantano, et al. · (2024) | TGRS Research Map | TGRS