Selection of Non-Clean Flux for Metal TIM

This study mainly explored the application of indium sheets in the manufacturing of flip chip ball grid array (FCBGA) products. Because such products must undergo a high-temperature ball mount reflow process, the residual flux evaporates under high temperature reflow process and generates multiple voids on the indium surface. Due to the above limitations, the selection of flux is very important for the application of metal TIM for flip chip package products.